Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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ID Reader 8
ID Reader 8″ is the best tool to avoid lot errors. Designed for using 200mm – 8″ notch aligner and OCR system, it checks your carrier tag, reads each wafer scribes, then sends the information to your Host with SECSII Gem commands
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High Voltage 50 Ω Pulse Generator
TLP-4010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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Wafer-Level Parametric Test
Wafer-level reliability engineers need to reduce test time without sacrificing measurement quality and accuracy.
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Surface & Volume Low Resistivity Meter for Conductive Materials
Loresta GP
The Loresta GX Meter is an intelligent, multi purpose low resistivity meter equipped with software that calculates resistivity correction factors. A variety of 4 pin probes are available for use with the Loresta GX. The instrument is typically used in Product Engineering, R&D, and Quality Control. Applications include measurement of conductive paint, conductive plastics, conductive rubber, conductive film, silicon wafers, antistatic materials, EMI shield materials, conductive fiber, conductive ceramics, etc.
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Non-contact Sheet Resistance /resistivity Measurement Instrument
EC-80
*Easy operation and compact design*Auto-measurement start by inserting a wafer under the probe*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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E-Chuck Supplies
Advanced Energy's Trek e-chuck supplies have been a staple in the semiconductor industry for decades. They allow you to improve throughput, virtually eliminate sticky wafer and wafer popping issues, and reduce backside gas errors.
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Metrology & Inspection Systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Backgrinding & Stress Relief
Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Non-contact Conductivity Type (P/N) Checker For Quick Check
PN-50α
*Principle: Photovoltaic effect by light pulse irradiation*No damage and no stain by Non-contact method*Possible to check even oxidized film on wafer surface*Instantly discrimination by optical pulse illuminate
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Electrostatic Chucks
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Vision Metrology System
NGS 3500Z
This bench top lower cost, yet high performance system is designed for applications where defect detection and precisionmeasurements on wafers and other parts (up to 200 mm) are required. It is well suited for use as a dedicated productiontool or as a versatile process development system. It features a powerful set of automated as well as semi-automaticoptical/ video tools optimized for high accuracy, production throughput, and ease of use.This automated and versatile platform features a standard Nikon/ Olympus bright/ dark field microscope with optionalNomarski, and precise part staging. This system offers significant and unique advantages for dual production/ engineeringuse, and provides the perfect solution when both defect detection and dimensional metrology are required.
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WATOM
Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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kSA BandiT
The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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Probe Station
S-1160
S-1160 Probe Station 100mm, 150mm and 200mm wafer stage's completely manual and user friendly.
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Non-contact Sheet Resistance/resistivity Measurement Instrument With PC
NC-10 (NC-20)
*Easy operation and data processing by PC*No damage measurement by non-contact eddy current method*Replaceable probes by meas. range (*Second or more probe is for the option)*1 point measurement of center position*5 types of model for each measuring range*Temperature correction for silicon wafer function
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2D/3D Wafer Metrology System
7980
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Semiconductor
DieMark
DieMark Inking Systems are available in Electric and Pneumatic models and utilize convenient, disposable DieMark Ink Cartridges to streamline and optimize the process of marking defective die. With models available for nearly every test platform and configuration, Xandex inking systems are in operation daily in every corner of the world where wafer sort is performed.
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Conductivity Type (P/N) Checker By Contact Thermo-electromotive Force Method (seebek Effect)
PN-12α
*Thermo electrode and cold electrode is mounted detecting part of measuring probes*Possible to check most figure of sample such as single crystalline silicon wafer, bulk, ingot and so on*Please select from 2 types;1) 2 probe ver.(Hot probe, Cold probe),2) 1 probe ver.(Hot & Cold probe)
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MPI SiPH Probe Systems
MPI Advanced Semiconductor Test
MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE
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IGBTs
Renesas insulated-gate bipolar transistors (IGBTs) realize both low saturation voltage and fast switching through thin wafer technology. Product series suitable for a variety of applications are available, and help to cut down all kinds of power loss.
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Discrete Devices High-speed Testing System
QT-6000 discrete device high-speed testing machine is suitable for testing small and medium-power diodes, transistors, field effect transistors and other products and wafers. It can expand built-in capacitance testing (DC+CAP), EAS, VC, pA modules, as well as external LCR (ultra high precision capacitance testing), Scanbox, etc. The machine can be used for FT mass production testing or laboratory testing.
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Vacuum Probing Systems
Built using our PS4L patented technology, SemiProbe manufactures a family of Vacuum Probing Systems, which test wafers or substrates in a vacuum environment. Additionally, individual die and broken/partial wafers can be tested with the Vacuum Probing System. All key modules are interchangeable and upgradeable.
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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STDF Test Data Analysis Tool
DataView
DataView is a low‐cost test data analysis tool that is used by test and product engineers to perform characterization of integrated circuit devices. DataView reads in industry standard STDF or ATDF files and can produce reports, histograms, and wafer maps in multiple formats including Excel. DataView is ideal for the test or product engineer who needs a fast and simple tool to analyze characterization data.
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Semiconductor
Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
