Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
Mixed Signal Test Systems
MTS1000i
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The MTS-1000i is lowest cost platform available in the MTS series of ATE. It has a reduced platform size compared to the MTS-2010i & MTS-1020i, reduced power supplies, and 4 slots. It is mainly intended for single site testing. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process
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Product
Pressure Switches
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Whitman controls offers the most diverse selection of pressure switches in the industry. Our diverse line of switches are used across a wide range of applications including blowers, generator sets, off-road vehicles, compressors, wafer ovens, process equipment, flow control devices, pumps, wastewater, heating and cooling systems, and numerous other applications across industries.
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Product
04 With Soldering Eyelets | 1 Wafer | 12 Positions
04-1xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Front-end
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With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Multiple Angle Reflectometry
FilmTek 4000
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Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
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Product
Probe Series
CAPELLA Series
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MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Product
Component Testers
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After a wafer is tested through front-end test and back-end test, the component tester tests this final component or package assuring its quality for the semiconductor makers. DDR, DDR2, DDR3 memory component testers.
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Product
Conductivity Type (P/N) Checker By Contact Thermo-electromotive Force Method (seebek Effect)
PN-12α
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*Thermo electrode and cold electrode is mounted detecting part of measuring probes*Possible to check most figure of sample such as single crystalline silicon wafer, bulk, ingot and so on*Please select from 2 types;1) 2 probe ver.(Hot probe, Cold probe),2) 1 probe ver.(Hot & Cold probe)
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Product
MPI SiPH Probe Systems
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MPI Advanced Semiconductor Test
MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE
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Product
04 With Pins For PCB | 3 Wafers | 24 Positions
04-3xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
Meters For Contact Angle And Surface Tension + Semiconductor Technology, Micro Scriber
SURFTENS HL Automatic
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Optik Elektronik Gerätetechnik GmbH
Fully automatic contact angle meter for silicon wafers up to 12 inch The contact angle measuring system SURFTENS HL automatic is designed for use in semiconductor industry and research, in particular for process control of wafer coating and in the photolithographic process.
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Product
Wafer Thickness Measurement System
MPT1000
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Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Product
Test Head Manipulators
Cobal 250
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The Cobal 250 offers the best-in-class range of motion for universal manipulators with seven degrees of motion. Separate linear movements make it easier for the operator to dock, undock, and redock the test head in seconds. In combination with inTEST EMS docking, the Cobal 250 is compatible with testers for both Wafer Sort and Final Test, minimizing the time and cost when moving a tester between Sort and Final Test.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
Multi-Surface Profiler
Tropel® FlatMaster® MSP
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The Tropel® FlatMaster® MSP (Multi-Surface Profiler) is a frequency stepping interferometer that provides fast and accurate metrology for semiconductor wafers up to 300mm in diameter. In seconds up to 3 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface.
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Product
Process & Material Characterization System
TriboLab CMP
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Bruker’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of waferpolishing processes. Small R&D-scale specialty system for CMP. Reproduces full-scale wafer polishing process conditions without downtime on production equipment. Provides unmatched measurement repeatability and detail. Allows testing on small coupons for substantial cost savings over whole-wafer testing.
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Product
Dimensional Metrology
Integrated Metrology Family
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Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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Product
Semi-automated Metrology System
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Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Semiconductor Test Equipment
IC Tester
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Equipment to determine the pass/fail of devices in the wafer inspection process and the final inspection process after packaging.
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
04 With Soldering Eyelets | 4 Wafers | 12 Positions
04-4xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Custom Assembly, Packaging and Qualification
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DPACI specializes in providing Turn-Key Solutions. We offer comprehensive manufacturing, assembly, qualification, testing, and certification of high reliability EEE components. We have a dedicated, self-contained Class 10,000 clean room with Class 100 laminar flows certified to QML Q (Military) and V (Space) levels to perform all assembly operations from wafer processing to final hermetic package seal
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Product
Software
Junction Measurement and Analysis
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Materials Development Corporation
A comprehensive set of analyses for junction diode or Schottky barriers begins with C-V data gathering that adjusts the voltage step to the slope of the C-V characteristics. This assures an optimum set of C-Vdata whether the voltage range is small or large. Doping profile and resistivity profile are both available at the touch of a key. Plots of 1/C2 - V or Log(C) - Log (V+ phi) show doping uniformity and doping slope factor. Exclusive recalculation options allow adjustment of stray capacitance and area to facilitate calibration using a standard reference wafer of known doping or resistivity.
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Product
Hi-Speed Discrete Test System
QT-6000
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QT-6000 Test System, with built-in capacitance test (DC+CAP) and Scanbox etc, is applicable to devices like medium & small power transistors, MOS-FET, diodes and Wafer.
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Product
Solar Wafer Transfer Tool
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Product
Reticle Manufacturing
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An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
