-
Product
3 Phase Choke Coils
-
Supreme Instrument Laboratories
Suitable for operation on 415 / 440 V, A.C. 50 Hz. Working on air gap separation by increasing / decreasing the air gap with the help of a hand wheel mechanism, mounted on thick wooden / bakelite sheet with castor wheels for easy transportation.
-
Product
Digital Thickness Gauges Paint Gauge Meter
HC-200
-
Shenzhen Chuangxin Instruments Co., Ltd.
HC series of coating thickness gauge is a portable thickness gauge with eddy current thickness method and electromagnetic thickness method. It can be used to quickly and accurately measure the thickness of coating or cladding material without damaging it. As an essential instrument for professional material protection, this coating thickness gauge is widely used in manufacturing industry, metal processing industry, chemical industry and commodities inspection etc. ,both in the laboratory and in the engineering field. It can measure the thickness of nonmagnetic layer on magnetic metal substrate condition (such as steel, iron, alloy and hard magnetic steel, etc.) and the thickness of conductive layer on nonmagnetic metal substrate condition (such as rubber, paint, plastic, anodic oxidation film, etc.).
-
Product
High Performance Fluorescent X-ray (XRF) Coating Thickness Gauge
FT150 Series
-
Hitachi High-Technologies Corp.
The FT150 is a high-end fluorescent X-ray coating thickness gauge equipped with the polycapillary X-ray focusing optics and Vortex silicon drift detector. The improved X-ray detection efficiency enables high throughput and high precision measurement. Furthermore, new design to secure wide space around sample position gives exellent operability.
-
Product
Coating Thickness Measurement Gauges
-
ElektroPhysik Dr. Steingroever GmbH & Co. KG
Handy, universally applicable coating thickness gauge in three versions: Integrated probes, cable probes and interchangeable internal and external probes.
-
Product
RTX
ROM-3310
-
ROM-3310 RTX2.0 module integrates an ARM Cortex A8 single core 1 GHz TI AM3352 series ultra low power SoC and I/O solution with Linux. TI AM3352 supports multiple serial ports, 5V~24V wide range power inputs, and wide temperature -40 ~ 85 °C operation for data collection in industrial applications. Based on a thickness of 2 mm board, it uses an anti-oxidization golden finger design
-
Product
Ultrasonic Thickness Gauge
38DL PLUS
-
The 38DL PLUS is an innovative instrument that signals a new era in ultrasonic thickness gauging. Ideally suited for almost every ultrasonic thickness application, this handheld thickness gauge is fully compatible with a full line of dual and single element transducers. The versatile 38DL PLUS can be used in applications ranging from wall thinning measurements of internally corroded pipes with dual element probes to very precise thickness measurements of thin or multilayer materials with single element transducers.
-
Product
Transducers, Cables, Couplants & Test Blocks
-
Olympus offers a complete selection of transducers, cables, couplants, calibration test blocks, and accessories to meet a wide variety of ultrasonic precision thickness gaging applications.
-
Product
Handheld Gauge for Nondestructive Coating Thickness Measurement
PHASCOPE PMP10
-
The most experienced device in our tactile portfolio – reliably solves all special applications.
-
Product
IEC60335-2-9 Clause 3 Figure 103 Vessel For Testing Hotplates
CX-GZ
-
Shenzhen Chuangxin Instruments Co., Ltd.
IEC60335-2-9 clause 3 figure 103 Vessel for testing hotplatesParameter:1.Pot and lid material industrial aluminum2. Pot material thickness 2 mm;3. The bottom of the pot body can not be outward convex, can not exceed 0.05mm;4. Pot body and lid surface should be smooth;5, size: 110, 145, 180, 220, 300mm each one
-
Product
Erichsen Cupping Testing Machine
GBW Series
-
Jinan Testing Equipment IE Corporation
GBW series Erichsen Cupping Testing Machine is designed on the basis of screw universal material testing machine. The Erichsen Cupping Tester is suitable for cupping test of metal sheet and strip steel rolled stock etc to evaluate the plastic deformation performance and ductility. The cupping test for metal sheet thickness range is 0.1mm to 5mm, Max. punching capacity is 300KN, and the pre-tightening device is optional either with hydraulic servo loading pump or manual loading pump.
-
Product
Ignition Pulse Detector
IP-3000A
-
IP-3000A Ignition pulse detector is a slim and light weighted detector by using amorphous metals fiber element. It is 1/4 in thickness (mass: approx. 1/50) and 1/3 in weight compared with the previous model of Ono Sokki. Also the IP-3000A can obtain constant output from low to high rotation with high sensitivity.Meeting the needs of structure or mechanism in recent gasoline engines, the IP-3000A can easily clamp around an ignition coil cable (the primary side cord of ignition coil or the current cord of electronic distributor). Moreover, heat-resistant design up to maximum operating temperature of +120 C° enables measurement under harsh environment.The IP-3000A Ignition pulse detector can be used with Ono Sokki’s engine tachometer.
-
Product
Ultrasonic Wall Thickness
UTG
-
The PosiTector UTG measures the wall thickness of materials such as steel, plastic and more using ultrasonic technology. Ideal for measuring the effects of corrosion or erosion on tanks, pipes or any structure where access is limited to one side. Multiple echo (UTG M) Thru-Paint models measure the metal thickness of a painted structure without having to remove the coating.
-
Product
Fully Automatic Non-contact Sheet Resistance Measurement System For Flatpanel Display
NC-60F/RS-1300N
-
*Global standard for non-contact measurement of ITO film, Metal thin films on flat panel*Automatic X-Y and Z (eddy current probe head) axis moving mechanism*Compatible with Loading robot for fully automatic measurementOption :*Integlate to combined system (film thickness meter, etc)*Add 4 point probe measurement unit : RT-3000
-
Product
Portable Microscope With XY Stage, X400 1mm Field Of View, 1µm High Resolution
-
*Counting of cells, algae and other samples*Easy positioning of the sample*Methodically scanning of slides and some counting chambers*Works with standard microscope slides (25x75mm or 1”x2”) and 32mm wide counting chambers (top cover of counting chamber needs to be <1mm thick)*Allows manual movement of the slide and counting chamber independently in the left-right (X) axis and front-back (Y) axis
-
Product
System
SpecMetrix
-
SpecMetrix systems by Sensory Analytics were designed from the ground up to precisely measure the absolute thickness of just about any coating on any substrate. All our systems are flexible for use in virtually any manufacturing environment. They provide coating thickness data of unprecedented accuracy—helping manufacturers reduce costs by optimizing coating process control and product quality. Our systems are easily configured to measure webs, coils, flat sheets, small samples or finished parts.
-
Product
Film Shrink Tester
-
The Hanatek FST Film Shrink Tester is used to measure the effect of temperature on plastic films. The application of heat causes certain plastic films to rapidly contract; this effect can be used to seal and pack many items from food to consumer goods. The shrink effect is due to internal forces locked into the film during manufacture being released by heating, it is also known as linear thermal shrink or free shrink. The amount of shrinkage is dependent on the film type, thickness and sealing temperature. Testing the percentage shrink of a film ensures that it is suitable for a particular packaging application and establishes the correct temperature for that application.
-
Product
Acoustic Microscope
AMI D9650Z
-
The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.
-
Product
Thick Film Passive Element
GBR-403
-
GBR-403 series high voltage resistors are made in a thick film technology on ceramic substrates (Al2O3 96%). These elements are used in high voltage applications requiring high stability and resistance.
-
Product
Micrometer - Specialty
-
Used for specific jobs like measuring the inside and outside dimensions of tube thickness, gear teeth, pitch diameter of fasteners, and for measuring sheet metal thickness.
-
Product
Thick Film Heating Elements
GBR-200
-
GBR-200 series high voltage resistors are made in a thick film technology on ceramic substrates (Al2O3 96%). Those elements are used in high voltage applications requiring high stability and resistance.
-
Product
Standoff Capacitors
-
In standoff capacitors, SemiGen offers controlled dielectric thicknesses of +/- 12 microns, < 0.1 micron mounting surface finishes, and outline (L&W) tolerances of < 25 microns. We assure lot-to-lot repeatability and very attractive pricing. RF engineers requiring jumper mounts, bypass and tuning capacitor flexibility will find our wide selection of standoff capacitors convenient and reliable.
-
Product
IR Sensor
-
The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
-
Product
High Quality UCI - And Leeb-measuring Technology
SONODUR Product Family
-
Foerster Instruments, Incorporated
The non-destructive UCI test method (Ultrasonic Contact Impedance) as well as the Leeb test method enable fast and mobile measurement as a supplement to the classical hardness test. Due to the compact measuring probes and sensors of the SONO series, the devices can also be used in difficult test positions and with complex component geometries. Fields of application are e.g. incoming goods inspection, mix-up testing, production control, quality assurance, weld seam testing, cut edge testing, maintenance on installed components as well as the replacement of dynamic hardness testers for small material thicknesses (below 50 mm, e.g. boilers, tubes).
-
Product
Coating Thickness Measurement
-
The Calotest instruments from Anton Paar provide quick, simple and inexpensive determination of coating thicknesses. Employing the simple ball-cratering method, the thickness of any kind of single or multi-layered coating stack is accurately checked in a short time, in full compliance with relevant international standards.
-
Product
Backgrinding & Stress Relief
-
Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
-
Product
WAFERMAP
-
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
-
Product
Thick Film Inspection
785
-
For thicker coatings such as coal tars, extruded and tape coatings, the Model 785 has a range of infinite voltage settings from 1,000 to 15,000 volts.
-
Product
Substrate Manufacturing
-
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
-
Product
Instruments for Coating Thickness Measurement
-
Instruments for Coating Thickness Measurement according to the Coulometric Method by anodic dissolution (DIN EN ISO 2177). For electroplated coatings like tin, zinc, nickel, chromium, copper, brass, silver, gold can on metals or non-metals.
-
Product
Ellipsometry And Reflectometry Systems
-
Based on non-contact optical techniques, FilmTek tools simultaneously measure multiple-angle and multi-modal data to determine film thickness and refractive index. By measuring multiple angles of incidence, a wavelength shift is introduced between spectra collected at different angles. The wavelength shift between the spectra is only a function of the refractive index of the film and the angle difference between the spectra. By independently determining refractive index from a wavelength shift (as opposed to extracting index information from amplitude changes), FilmTek tools have best-in-class performance for film thickness and refractive index measurement. This level of performance allows FilmTek tools to address applications that otherwise may not be possible with more conventional ellipsometry or reflectometry methods.
