Deposition
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Atomic Layer Deposition Systems
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Atomic Layer Deposition (ALD) is a powerful way to build ultra-thin, super-precise coatings, one atomic layer at a time. It’s especially useful and efficient when working with tiny, complex 3D structures, making it a go-to technique in advanced semiconductor manufacturing.
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Deposition Systems
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When a thin film requires the most stringent structural or compositional properties consistently across every layer, Veeco’s Ion Beam Deposition (IBD) technology is often the answer. Using a focused beam of ions to sputter material from a target, this physical vapor deposition technique builds dense, uniform films with standout adhesion and stability.
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Particle Deposition Systems
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MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Physical Vapor Deposition Systems
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Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.
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Gridded RF Ion Sources
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Veeco's gridded RF ion sources are designed for improved production of long-run ion beam deposition processes.
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Pulsed-DC Systems
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Extend process innovation with Advanced Energy’s comprehensive pulsed-DC suite. Minimize arcing, enhance deposition rate, improve film flatness and packing density.
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Handheld Ultrafine Particle Size Distribution Measurement.
partector 2 Pro
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Naneos Particle Solutions gmbh
The naneos partector 2 Pro version is a further development of the well-established Partector 2. The Pro version of the partector 2 can additionally switch through different deposition voltage levels and therefore scan an 8-channel size distribution of an aerosol of interest.
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X-Ray Detector
XRT Detector Onyx
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ONYX 1412-X is a performance-leading X-ray detector comprising a proprietary 2768 × 2376 active pixel sensor array of 50 × 50 µm pixels. This detector consists of a high-speed, low-noise, radiation-tolerant, 14 × 12 cm, 6.6M pixel CMOS image sensor, with a directly deposited high-resolution CsI scintillator on Fibre Optic Plate. The highly configurable sensor is accessed through a software interface, connected via a 10 GbE SFP+ hardware interface.
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Metrology System
Aspect
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Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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ICP Plasma System
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The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Ozone Gas Delivery Systems
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MKS ozone gas delivery systems provide field-proven, high concentration, ultra-clean ozone generation for advanced thin film applications such as Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Tetraethyl Orthosilicate (TEOS)/Ozone CVD (HDSACVD), contaminant removal and oxide growth. Gas delivery models have integrated ozone concentration monitoring, flow control, and power distribution. Additional system options include safety monitoring, status indicators and ozone destruction capability.
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Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
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In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Solder Past Inspection
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From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Duct Deposit Measuring System
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The Elcometer 456 Duct Deposit Measuring System has been specifically designed to meet the requirements of the DTT (Deposit Thickness Test) in HVCA’s (Heating & Ventilation Contractor’s Association) Guide to Good Practice, for the measurement of dust and grease deposits within ventilation systems and kitchen ducts made of ferrous metals.
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ALD
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Atomic Layer Deposition (ALD) offers precise control down to the atomic scale.Atomic layer deposition holds tremendous promise across a wide array of industries, including energy, optical, electronics, nanostructures, biomedical, and more. Please check out our Applications section for more details in any and all of these areas.
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kSA RateRat Pro
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kSA RateRat Pro is a compact, convenient and easy-to-use optical metrology tool for thin-film characterization. Its unique capability is to measure, in situ and in real-time, optical constants (n and k), deposition rate and film thickness.
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Digital Mammography
ITA
Analogic is an established worldwide leader in direct conversion digital detector technology used in digital mammography. We develop and manufacture flat-panel, direct conversion digital detectors used by major medical OEMs in mammography systems. These plates capture image data directly onto a patented detector made with a layer of amorphous selenium deposited onto a thin-film transistor array.
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Dynamic Ultra Micro Hardness Tester
DUH-210/DUH-210S
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A new evaluation system for measuring the material strength of micro regions, such as semiconductors, LSI, ceramics, hard disks, vapor deposited films, and thin coating layers, not addressed by previous hardness testers. It can also be used to evaluate the hardness of plastics and rubbers. This instrument uniquely measures dynamic indentation depth, not the indentation after the test. This in turn permits measurement of very thin films and surface (treatment) layers that are impossible to measure with conventional methods. Additionally, this same method supplies the data needed to calculate elastic modulus on the test specimens.
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Lens Measurement Spectrophotometers
LINZA 150
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LINZA 150 spectrophotometer is designed for broadband transmittance and reflectance measurement of lenses and lens assemblies (objectives) ensuring that only perfect lenses are approved for lens assemblies, delivered to customers or meet specs provided to your lens supplier. The instrument is perfectly suited for both routine lens measurements and sophisticated improvement of lens production technology: Fast on-axis transmittance measurement of individual convex/concave lenses. Fast on-axis transmittance measurement of lens assemblies (objectives). Unattended on-axis and off-axis reflectance measurement of individual lenses providing measurement data virtually from any area on lens surface (both convex and concave). Ideal for fine-tuning of deposition technology used to produce coatings on lenses.
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PED Systems
Pulsed Electron Deposition
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Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
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Multi-Element Standards
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These multi-element standards consist of multi-layer thin film coatings, one on top of the other, upto a maximum of 6 elemental coatings. It is generally recommended to have coating thicknesses < 20 µg/cm2, so as to cause negligible notable matrix effects, in particular absorption of X-rays emitted in lower deposits by those covering them.
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PLD Systems
Pulsed Laser Deposition
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Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred deposition technique where ever thin films of complex material compositions are considered. Another unique feature of PLD is its ability for rapid prototyping of materials. The energy source (pulsed laser) being outside the deposition chamber, facilitates a large dynamic range of operating pressures (10-10 Torr to 500 Torr) during material synthesis. By controlling the deposition pressure and substrate temperature and using relatively small target sizes, a variety of atomically controlled nano-structures and interfaces can be prepared with unique functionalities.
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Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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High Temperature Absolute Pressure Transducers
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Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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PICO Pµlse Contact Dispense Valves
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This contact dispense valve provides many of the same benefits of the PICO Pµlse jet valve, including high-speed dispensing at up to 1000Hz continuous*. It also delivers more accurate contact dispensing with less turbulence for greater fluid deposit consistency, placement, and process control.
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kSA BandiT
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The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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ALD Knowledge Center
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As one of the first companies to market with a flexible commercially available atomic layer deposition system (ALD), we have a tremendous ALD Knowledge Center for researchers to draw upon. We have gathered together a wide range of information about ALD applications and thin films technology. This includes images and explanations of the exciting uses for ALD. We also gather and provide access to theses on the subject and a searchable database of scientific abstracts.
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Field Portable NIR Spectrometers For Mineral Identification And Analysis In Mining Exploration
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With Spectral Evolution field portable NIR spectrometers and EZ-ID mineral identification software, geologists can measure and identify minerals within seconds and cover more ground than by using traditional methods. They can identify different mineral phases, create mineral alteration maps and more accurately identify mineral pathfinders for vectoring to ore deposits. Spectral Evolution's field portable, battery-operated oreXpress, oreXplorer and oreXpert ultra-high resolution NIR spectrometers are designed for mineral identification in mining exploration. The oreXpress, oreXplorer and oreXpert provide quick payback with faster, more accurate mineral identification in exploration for gold, silver, diamonds, iron, nickel, copper, uranium, aluminum - in the field, core shack, or in the lab, and provide:
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Product
Trace Moisture Analyzer
Model 8800P
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Teledyne Analytical Instruments
The 8800 series uses field proven aluminum oxide (Al2O3) sensing technology to accurately detect trace moisture on either a continuous or spot checking basis. All Al2O3 sensors share the same basic operating principle: the capacitance measured between the sensor’s aluminum core and gold film deposited on the oxide layer varies with the water content. The 8800 series moisture sensor employs unique Hyper Thin Film (HTF) technology, which offers three major structural improvements in Al2O3 sensor design. These structural changes, noted below, provide the user with increased sensitivity, greater stability and a quicker response time when compared to other conventional aluminum oxide sensors on the market today.
