Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Product
RF Bias Burn-In System
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These systems deliver an unbeatable combination of advantages over a wide range of RF frequencies and power levels. The Automated Multi-Channel RF-Biased Burn-In Test System is a turnkey system that incorporates all of the capability needed for accelerated aging and parametric testing of RF semiconductor devices. Its powerful software elegantly supports data acquisition, storage, and presentation. Accel RF’s customers choose system features to meet their technical needs and capital budget. In addition to cost savings, use of Accel-RF’s solutions accelerate product time-to-market, saving many months of product development.
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Product
Module Accessory Kit, Quantity 26, 4-40 x .625" Socket Head Cap Screws
510109302
Accessory Kit
Module Accessory Kit, Quantity 26, 4-40 x .625" Socket Head Cap Screws
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Product
ZIF (Zero-Insertion-Force) Socket
Series 516
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Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Contacts are normally open and are closed by a unique cam action controlled by dual lever arms. The last 15° of movement of the cam provides a wiping action to the contacts on the legs of the device to remove any residue, ensuring a gas-tight seal.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, HDMI, DVI-D, VGA, 8-CH PoE, 6 USB And 24 VDC
eBOX671-517-FL
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The eBOX671-517-FL supports 8-port Gigabit PoE and able to work under harsh temperatures. Its eight Gigabit PoE ports allow multiple cabling to cameras and any PoE power device; and, the eBOX671-517-FL is specifically designed for security surveillance, optical inspection, and edge computing applications. This rugged NVR embedded box PC is powered by the 7th/6th generation Intel® Core™ (Kaby Lake/Skylake) or Intel® Celeron® processors with a 35W/65W TDP and comes with Intel® Q170 chipset. The eBOX671-517-FL comes in great expansion possibilities, including a flexible I/O module slot with a wide selection of PCIe Mini modules and four PCI Express Mini Card slots. It also has two front-accessible SIM slots and four SMA-type antenna connectors. For storage, this high performance fanless embedded system has two SATA HDD drive bays with a height of up to 15 mm and one optional mSATA for RAID 0 and 1. Moreover, the embedded device supports two non-ECC 260-pin DDR4 SO-DIMM slots for up to 32GB of system memory.
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Product
SIMRC- 72 Pin Simm Socket
1090-001
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Our small format embedded switching (SIM relay) cards offer a choice of switching configurations using low cost industry standard SIM connectors. They free the designer from the detail of routing complex switching circuits, you may select from a wide range of cards using the built in RS-232 and I2C interfaces. These low-cost embedded switching cards are intended to be mounted on to a simple motherboard. They may be used to construct very high density switching networks. SIM based switching cards also allow for very simple in-field maintenance.
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Product
Probe Tip Ground Lead with 0.8 mm Socket
PK007-024
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Probe Tip Ground Lead with 0.8 mm Socket.
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Product
Test Socket
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Our test sockets are made for high performance and are of top quality, to guarantee a smooth, effortless process. We believe in providing our partners and customers with effective and intelligent solutions that they can apply with ease. Choose the solutions of TTS Group cater to the needs of detailed and complex systems.
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Product
Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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Product
Module Accessory Kit, Quantity 26 4-40 x .560" Socket Head Cap Screws
510109303
Accessory Kit
Module Accessory Kit, Quantity 26 4-40 x .560" Socket Head Cap Screws
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Product
Surface Mount Ball & Socket Test Point
SMOX
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SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.
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Product
Socket Accessories (Thru-Hole Options)
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The male pin adapter consists of standard high temperature FR4 with pressed in terminal pins and threaded inserts for mounting the socket. The top side of adapter has gold plated pads to receive socket interconnect and the bottom side has 0.006″ to 0.018″ diameter pin tails. These pins can be soldered to the plated thru holes in the target board. Then socket can be mounted to the threaded insert.
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Product
Volt Probe & Socket Testers
Non-Contact & Socket
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Use Amprobe non-contact volt probes to safely check circuit breakers, wall sockets and fuses for voltage presence with portable, economical tools. For sockets, choose an Amprobe socket tester, which can confirm whether GFCI breakers are properly wired.
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Product
Lo-PRO®file ZIF (Zero-Insertion-Force) Socket
Series 526
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LO-PRO file Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. A metal cam provides strong, smooth action as it moves to a positive stop, compressing the double-sided contacts, ensuring a gas-tight seal.
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Product
Open-Frame Collet Socket with Solder Tail Pins
Series 518
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Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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Product
3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Product
Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Product
2U Rackmount Network Appliance Platform With Dual LGA3647 Socket Intel® Xeon® Scalable Processors, Intel® C621 (Purley) And Up To 66 LAN
NA860
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The NA860 offers a perfect mixture of performance, flexibility, and durability with server-class dual LGA3647 socket Intel® Xeon® Scalable processors and Intel® C621 chipset (codename: Purley). It is robust and highly reliable for use in a wide range of network applications such as SDN, NGFW, IDS, IPS, UTM, etc. Designed with flexibility in mind, the 2U rackmount network computing system is capable of managing numerous connected computers through an integration of up to eight expandable NIC modules which support a maximum of 66 LAN ports. These NIC modules feature support for copper, fiber, bypass, 1G/10G/40G Ethernet speeds, and hardware acceleration. The NA860 comes with twelve high-capacity DDR4-2400 R-DIMM slots with up to 384GB non-buffer non-ECC/ECC memory. Moreover, there are two hot-swappable 2.5-inch SATA HDD trays, one mSATA slot and one optional 3.5-inch SATA HDD tray for sufficient storage. Two PCIe x8 expansion slots are available for add-in cards.
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Product
1U Rackmount Network Appliance Platform With LGA1151 Socket Intel® Core™/Xeon® E-2100 Series Processor, Intel® C246/H310 And Up To 26 LANs
NA590
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*LGA1151 socket 8th gen Intel® Core™/Xeon® E-2100 series processor (Coffee Lake)*Four DDR4-2666 U-DIMM for up to 64GB of memory*Max. up to twenty-six 10/100/1000 Mbps Ethernet ports*Two expandable LAN modules supporting 1GbE/10GbE/25GbE/40GbE/Fiber/Copper/Bypass*Supports 1U redundant power supply for optional*Supports IPMI/TPM for optional*Suitable for network security, cloud computing and data centers applications
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Product
Module Accessory Kit, Quantity 39 0-80 x .250" Socket Head Cap Screws
510109300
Accessory Kit
Module Accessory Kit, Quantity 39 0-80 x .250" Socket Head Cap Screws.Used with 90 Series modules p/n's : 510104120, 510104123, 510104267 and 510104270.
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Product
System Level Test and Burn-in Solutions
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System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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Product
Socket Phone
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Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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Product
Micro ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, DVI-D, And HDMI
MMB501
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The MMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors (formally codename: Kaby Lake/Skylake) with Intel® Q170 chipset. The MMB501 supports four high bandwidth 288-pin DDR4-2133/2400 with a memory capacity up to 64GB. The industrial-grade micro ATX motherboard is expandable with one PCIe x16 slot, two PCIe x4 slots, one PCI slot and one full-size PCI Express Mini Card slot. Moreover, the embedded board supports triple-display via DisplayPort, HDMI, DVI-D and VGA interfaces. Furthermore, this outstanding multi-function embedded motherboard is integrated with the Intel® HD Graphics 530/510 to deliver stunning UHD 4K resolution and fast 3-D and video playback for graphics-intensive applications. To meet the distinct needs from users, there are six SATA-600 with RAID 0/1/5/10, six USB 3.0, five USB 2.0, four RS-232 ports, two RS-232/422/485 ports, one DisplayPort, one DVI-D, one HDMI and one VGA, as well as has two Gigabit Ethernet ports with Intel® i219LM and Intel® i211AT controllers. To ensure stable and reliable operation, the high-performance Intel® Core™-based industrial micro ATX motherboard supports a watchdog timer and hardware monitoring features. Furthermore, this new embedded board runs well with Windows® 7, and Windows® 10 operating systems.
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Product
Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-511-FL
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*Integrated real-time vision I/O**4-CH trigger input**4 trigger output**4-CH LED lighting control**2-CH quadrature encoder input**16-CH isolated DIO*Supports camera interfaces**4 IEEE802.3at GbE LAN ports (PoE)*Power input: 24 VDC (uMin=19V/uMax=30V)*-10°C to +60°C operating temperature range with W.T. SSD*Supports 2 swappable 2.5" HDD*Supports TPM 2.0 function
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Product
Socket Saver
4690
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The Technobox PMC Socket-Saver permits cost effective volume testing of PMC modules when used with Technobox P/N 3390 ?PMC to PCI adapter for Test.? It may also be used to reduce wear and tear on Technobox P/N 1518/1523 (?Extender/Preprocessor?).
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Product
Fanless Embedded System With LGA1150 Socket 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81, 2 HDMI/ VGA/ DisplayPort, 2 GbE LANs, USB 3.0, CFast™ And PCI Express Mini Card
eBOX635-881-FL
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The eBOX635-881-FL supports the 4th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® processor with Intel® H81 chipset. The super light yet compact eBOX635-881-FL comes packaged in an IP40-rated aluminum and cold-rolled steel enclosure and is designed to operate at temperatures ranging from -20°C to +50°C for use in the extremely environments. The fanless embedded system supports six jumper-less RS-232/422/484 and sixteen DI/DO ports along with three display outputs of two HDMI, DisplayPort and VGA for applications used in transportation, POS, kiosk, industrial control automation and medical equipment. Two PCI Express Mini Card slots are added to the system for greater expansion capability. One SIM slot is also available for 3G/4G, GPS, Wi-Fi and Bluetooth applications, allowing for more efficient networking options.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3100-CF Series
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- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM) and 5x Intel® i210-AT
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Product
Module Accessory Kit, Quantity 26 2-56 x .187" Socket Head Cap Screws
510109305
Accessory Kit
Used with modules: 510104128, 510104133, 510104134, 510104135, 510104136, 510104139 and 510104261.
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