BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Product
In-line High-Density ICT System Series 7i
E9988GL
In-Circuit Test System
The E9988GL Keysight i3070 Series 7i Inline High-Density In-Circuit Test (ICT) system brings industry-leading ICT technologies into your automated manufacturing line, saving resources and optimizing your automated test strategy.
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Product
GFCI Socket Tester
ST120
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The Fluke ST120 GFCI Socket Tester checks that each wire in the outlet is properly connected to the building's electrical system. Via the bright LEDs and included chart, you can quickly and easily verify the wiring of an outlet. Able to identify several common wiring errors, including reversed phase and neutral wires and an open ground, the ST120 will give you confidence on your next job.
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Product
Laser Diode Burn-in Reliability Test System
58604
Test System
The Chroma 58604 is a high density, multi-function, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 256 SMU channels which can source current and measure voltage in various control modes as described below.
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Product
3-Axis Non-Robotic Automated Testing System
AT3
Test Instrument
The Instron AT3 is a space-efficient, highly adaptable 3-axis mechanical testing platform designed for automated execution of tensile, compression, flexural, and lap shear tests. Built to comply with a broad spectrum of ASTM and ISO standards, it’s well-suited for evaluating materials such as plastics, elastomers, thin films, foils, and metals. The system streamlines the entire testing workflow from specimen measurement and handling to strain measurement and specimen disposal—enabling users to load up to 160 samples and let the AT3 take care of the rest. Boost productivity, reduce manual intervention, and achieve consistent, dependable results with every test cycle.
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Product
Automated Aerospace and Defense Test
test
Obsolescence management, evolving RF requirements, and design for test (DFT) challenges every test organization in the aerospace and defense industry. Organizations are transitioning from rack-and-stack box instruments and closed-architecture automated test equipment (ATE) systems to smarter test systems built on a modular platform that scales to meet current and future needs.
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Product
DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
Interposer
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Product
Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Tester, US Mains Socket
72-6861
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The 72-6861 is a Receptacle Tester with 3-indicator light. 2nd-Amber indication for ground contact (Open ground) and 3rd-amber indication for neutral contact (Open neutral) not connected, for hot and ground contacts interchanged indication by red and amber. If 2-amber indication occurred, receptacle is wired correctly.
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Product
Benchtop Automated Functional Test
midUTS
Functional Test
Combining bench-top portability with powerful automated test functionality, the midUTS is an extremely versatile yet cost-effective solution for your electronics functional test needs. Comprised of high-performance commercial-off-the-shelf (COTS) instruments, along with Bloomy’s medium-density signal-routing PCBAs, a built-in or USB-connected PC, and a pair of high-integrity, production-grade cables connected to an adjacent benchtop fixture, the midUTS can be used in engineering for PCBA bring up, as well as scaled to manufacturing to perform high-volume PCBA and sub-assembly functional testing. It is also ideal for depot diagnostic test, debug, and repair of field returns. The two mass-interconnected cables connect the midUTS to as many as 320 test points on the unit under test (UUT), supporting an extreme wide variety of products using bed-of-nails as well as cable-connected UUT test fixtures. Most importantly, the midUTS helps you automate sequences of functional tests using NI TestStand and the Bloomy EFT Module for TestStand. This ideal balance between powerful features and affordable cost allow you to automate earlier in the product development lifecycle, substantially increasing product quality and minimizing time-to-market!
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Product
Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
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Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
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Product
2-Module ICT System, I317x Series 6
E9902G
In-Circuit Test System
Keysight's family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.
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Product
Socket Tester
1945
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Peaceful Thriving Enterprise Co Ltd
This is a portable 220VAC socket tester to inspect the wiring conditions. The tester also features current variation for simulation of different leaking current. With the current variation, technician is able to test the condition of Ground Fault Circuit Interrupter (GFCI) / Residual Current Device (RCD) easily.
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Product
TEST SOCKET
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IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
BGA Rework Station
PDR IR-E6 Evolution
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The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Product
Socket Outlet Tester
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Using the new Testavit Schuki 1 LCD and 3 LCD, specialists easily check to see if sockets, cable drums or connecting cables are correctly connected in 230 V installations. Due to three LEDs, the connection status can be quickly and clearly determined. In addition, through the finger contact, it can be tested to see whether an impermissible, high contact voltage is applied at the protective earth connection. In addition, using the Testavit Schuki 1 LCD, a 30 mA FI circuit breaker (RCD) can be triggered via a pushbutton.
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Product
Functional Test
xUTS
Functional Test
Extend test to encompass copious test points and DUT varieties along with real-time, hardware-in-the-loop and other state-of-the-art instrumentation. extendedUTS (xUTS) is a custom product for high complexity functional test. Configured for the unique needs of a class of devices under test (DUTs), the xUTS employs our universal test system approach that combines the best open platform instrumentation and software along with mass interconnect technology.
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Product
Universal Test System
LEON System
Test System
A universal ICT, FCT, ISP and Boundary Scan platform.Based on the ABex platform, which directly integrates Konrad analog bus technology and PXI/PXIe in one chassis, the LEON platform can be configured to solve various test challenges. Due to this architecture only one system provides the complete test flow combining ICT, ISP, Boundary Scan and FCT.Various form factors and configurations allow a perfect combination between cost, speed and test coverage. The modular architecture provides the possibility to reconfigure or upgrade the systems based on your test needs.The LEON System software provides a powerful development and test execution environment which directly supports NI TestStand. All systems and components could be integrated into third party software using supplied APIs.
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Product
DIP-to-JEDEC TO Adaptor Socket
1109522 & 1109523
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DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Product
Socket Tester
ST120+
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The Fluke ST120+ GFCI Socket Tester with Beeper checks that each wire in the outlet is properly connected to the building's electrical system. Via the bright LEDs and included chart, you can quickly and easily verify the wiring of an outlet. Able to identify several common wiring errors, including reversed phase and neutral wires and an open ground, the ST120+ will give you confidence on your next job.
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Product
LTE RRM Test System
T4010S
Test System
The T4020S LTE RRM tester is the Keysight platform for LTE RRM conformance testing of LTE UEs. T4020S belongs to the Keysight LTE product family and, as the other LTE T4000S test platforms, is based on the T2010A LTE Wireless Communications Test Set.
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Product
Socket Accessories (SMT Options)
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The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Product
JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
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The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Product
NI Real-Time Test Cell Reference System
780590-35
test
VeriStand Full Development License with NI Standard Service , Include 1 Year SSP
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Product
Combination Board Functional Test System
QT 4256 ATE
Functional Test
Qmax Test Technologies Pvt. Ltd.
QT 4256 ATE is a combination Board Functional Test System , a main frame Automated Test Equipment (ATE) which can be configured up to maximum of 1280 Bi-directional digital channels ideal for testing circuit card assemblies of high level of complexity and whether it is a legacy or new generation PCB.
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Product
180V-260V AC Socket Tester With RCD Test (For UK)
1943
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Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 180~260VAC circuit.*LED indicators & Digital display.*30mA leakage current measurement.*RCD Test.I*t can perform self test after plug-in ( Voltage sould be above 180V ).*Detect faulty wiring status in 3 wire receptacle.*This socket tester will give LED indication as well if the main voltage is below 200V or above 260V.*Earth loop impedance test.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 11W*Frequency: 50Hz
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Product
Scienlab Battery Test System – Pack Level, 330 KW
SL1740A
Test System
Keysight’s SL1700A Scienlab Battery Test System – Pack Level Series allows to realistically emulate the environment of the future battery pack application in order to test the high-power battery pack comprehensively and improve its functions and safety. The growing demand of e-mobility increases the need of vast battery test labs for EV battery development. Keysight developed the SL1700A Series to accelerate the development and validation of batteries. It offers a voltage range of up to 1500 V and power options between 100 and 300 kW including a Performance Bundle to increase the power up to 330 kW. The new high-voltage SiC (silicon carbide) technology provides a high energy efficiency on a small footprint and helps to minimize your operating costs.
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Product
EMI Test System
TS9975
Test System
The R&S®TS9975 is the base system for conducted and radiated EMI measurements. Due to its modular design, it covers a wide range of applications and can be very easily adapted to the measurement task at hand. Any configuration is possible – from conducted measurements and the small precompliance system with a compact test cell to the accredited test system for large equipment under test. Combinations of different applications or incremental expansion are easily possible.
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Product
Automotive Ethernet Test Fixture
AE6941A
Test Fixture
The AE6941A automotive Ethernet electrical test fixture provides easy access to automotive Ethernet electrical signals so you can perform conformance testing and device characterization quickly and easily.
