BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Plug and Socket Gauges
Shenzhen Chuangxin Instruments Co., Ltd.
The plug and socket gauge is designed according to BS1363-1 and BS1363-2 standard.
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Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Socket with Collet Contacts
Correct-A-Chip
Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
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Safety Compliance Test System
EN 60601
Test system for electrical safety compliance testing of medical products in accordance with EN 60601-1, 3rd edition.The system is equipped with three test fixtures which are connected in parallel order to reduce the number of setup tasks for different variants in the course of day-to-day manufacturing processes. Its purpose is to test medical products, e. g. patient monitors, which are employed at hospitals to monitor heartbeat and oxygen saturation.Based on the integrated electrical safety tester by Associated Research, in combination with an AC power source and a switching matrix, it is possible to fully automate tests like for instance AC/DC high-voltage tests, insulation resistance measurements, earth connection tests and leakage current measurements.The required occupational safety is provided by a high-voltage safety hood in accordance with EN 501191. The entire safety technology, as well as the control PC, is mounted in an aluminum-profile cart.
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Relay Sockets & Accessories For Power Relays
Suitable for 35mm rail (DIN), wall or PCB mounting, timer modules, key receptables and retaining clips. See below for all models/series.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Semiconductor Test Software
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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Socket Saver
4690
The Technobox PMC Socket-Saver permits cost effective volume testing of PMC modules when used with Technobox P/N 3390 ?PMC to PCI adapter for Test.? It may also be used to reduce wear and tear on Technobox P/N 1518/1523 (?Extender/Preprocessor?).
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Test Fixture, Axial And Radial
16047A
The 16047A is designed for impedance evaluation of axial/radial lead type devices of up to 13MHz. The 16047A employs Kelvin contacts which realize a wide impedance measurement range. The contact tip can be changed according to the device shape.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Functional Test Trainer System
QT65
Qmax Test Technologies Pvt. Ltd.
Functional Test Trainer system, is a test system which can perform various Power- On functional tests of digital devices(ssl/MSI/LSIs and analog devices in the out- circuit and in-E conditions. Unified Library of vast number of devices to effectively test devices in in-circuit as well as out of circuit conditions.
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High Performance Chipscale Test Sockets
SC
Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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230V AC Socket Tester(For UK)
1942
Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 230VAC circuits.*Neon indicators.*Detect faulty wiring status in 3 wire receptacle.*Various combinations of 3 neon indicators tell if wiring is OK or 6 possible faulty conditions.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 1W*Frequency: 50Hz
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DDR5 X4/x8 78-ball BGA Interposer For Use With U4164A Logic Analyzers
W5643A
The W5643A DDR5 2-wing BGA interposer for DDR5 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W5643A is the smallest BGA interposers for DDR5 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding up to 5GT/s for protocol analysis and up to 4Gb/s for DQ capture. U4208A and U4209A probe/cables connect any W5643A DDR5 BGA interposer directly into the U4164A logic analyzer module using 61-pin high density zero insertion force (ZIF) connectors that attach to the W5643A BGA interposer wings.
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JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Universal Test Socket Receptacle
Series 6556
Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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Conformance Test System
TS-RRM
The R&S®TS-RRM 5G and LTE test system is a test solution for running 5G NR and LTE inter-RAT RRM test cases for certification of wireless devices.It is a fully automated conformance test system for running validated RRM conformance test cases. In addition to the RRM test cases required by GCF/PTCRB, the R&S®TS-RRM also supports carrier acceptance specific RRM tests.
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Volt Probe & Socket Testers
Non-Contact & Socket
Use Amprobe non-contact volt probes to safely check circuit breakers, wall sockets and fuses for voltage presence with portable, economical tools. For sockets, choose an Amprobe socket tester, which can confirm whether GFCI breakers are properly wired.
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PLCC Clips & Socket Plugs
Ironwood’s family of clips and plugs for PLCC packages can be used for connecting PCBs together or for gaining access to signals for testing.
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230V AC Socket Tester With RCD Test (For UK)
1944
Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 230VAC circuits.*Neon indicators.*RCD Test.*30mA leakage current measurement.*Detect faulty wiring status in 3 wire receptacle.*Various combinations of 3 neon idnicators tell if wiring is OK or 6 possible faulty conditions.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 1.5W*Frequency: 50Hz
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Lo-PRO®file Collet Socket with Wire Wrap Pins
Series 503
LO-PRO file Collet Sockets with Wire Wrap Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12011 for solder tail pins. Choose from several sizes and plating options.
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Test Sockets
Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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PCI Express 5.0 Test Platform
Teledyne LeCroy’s PCI Express 5.0 Test Platform is part of a suite of tools that facilitates complete protocol testing of PCI Express devices up to and including version 5.0. The latest feature of the Teledyne LeCroy Test Platform is the addition of an integrated interposer, which eliminates the need for an external interposer. This innovation simplifies setup with fewer connection points and outboard devices, making analysis easier and more reliable than ever. In addition to using the Test Platform with the Exerciser, the user can connect two of their own devices and use the Test Platform as a PCIe 5.0 backplane and as an interposer to capture protocol traffic between the systems.
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Pin-Line™ Collet Socket with Solder Tail Pins
Series 0513
Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.
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Off-Line Base Test Platform
6TL19
The 6TL19 is a bare half-rack with castors for creating Off-Line, modular, flexible, and reliable Base test platforms. The overall rack capacity is 11U (580mm depth).
