BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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EV Power Components End of Line Test Platform
Test and Validate all EV Power Electronics with One Flexible and Scalable Solution
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PCIe 4.0 Test Platform
PXP-400A
The Teledyne LeCroy PXP-400A Test Platform provides a convenient means for testing PCIe 4.0 cards with a self-contained portable and powered passive backplane. The PXP-400A provides power required for both cards under test, and an interposer can be used for connection to a protocol analyzer.
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Other Test Systems
Your business challenges do not fit the typical mold. Your test requirements are different. Ball Systems has more than 50 years of experience in multiple industries that has exposed our team to a wide variety of testing applications. As a result, we’ve likely created a solution for a challenge similar to yours.
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GFCI Socket Tester
ST120
The Fluke ST120 GFCI Socket Tester checks that each wire in the outlet is properly connected to the building's electrical system. Via the bright LEDs and included chart, you can quickly and easily verify the wiring of an outlet. Able to identify several common wiring errors, including reversed phase and neutral wires and an open ground, the ST120 will give you confidence on your next job.
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Tester, US Mains Socket
72-6861
The 72-6861 is a Receptacle Tester with 3-indicator light. 2nd-Amber indication for ground contact (Open ground) and 3rd-amber indication for neutral contact (Open neutral) not connected, for hot and ground contacts interchanged indication by red and amber. If 2-amber indication occurred, receptacle is wired correctly.
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Mini LED Backlight Module Automatic Optical Test System
7661-K003
Chroma 7661-K003 Mini LED Backlight Module Automatic Optical Test System contains a 71803-2 2D color analyzer to measure chromaticity and brightness
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Scienlab Battery Test System – Pack Level, 110 KW Extendable Version
SL1720A
Keysight’s SL1700A Scienlab Battery Test System – Pack Level Series allows to realistically emulate the environment of the future battery pack application in order to test the high-power battery pack comprehensively and improve its functions and safety. The growing demand of e-mobility increases the need of vast battery test labs for EV battery development.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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CPE Design Verification System
Jupiter 310
Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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RF Socket
With unparalleled technology, coaxial structure, and high-precision machining equipment, LEENO can provide RF test socket with high bandwidth, impedance matching and high frequency up to 40GHz.
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QFN Sockets
With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Socket Tester c/w Buzzer
DL1090
Clear visual and audible indication of wiring status LED indication of a wide range of wiring conditions Designed to EN 61010 and IP30
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Camera Module Socket
Designed for application to all SMD type products, compact camera module clamshell socket provides a connector clip embodying precision in contact, a total interface solution.
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Parallel Electrode SMD Test Fixture, DC To 3 GHz
16196B
The 16196B surface mount devices (SMD) test fixture offers excellent repeatability and usability, with accurate correlation up to 3 GHz. 16196 series fixtures are custom designed to fit specific SMD sizes (see table below), and provide repeatable DUT positioning with reliable contacts to enable stable measurement results, reducing the possibility of operator-induced error. Traditionally, SMD inductor evaluation up to 3 GHz has been difficult to implement. Now with the 16196 series, it’s easy to perform accurate and repeatable measurements.
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Socket Tester
1945
Peaceful Thriving Enterprise Co Ltd
This is a portable 220VAC socket tester to inspect the wiring conditions. The tester also features current variation for simulation of different leaking current. With the current variation, technician is able to test the condition of Ground Fault Circuit Interrupter (GFCI) / Residual Current Device (RCD) easily.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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Fixture Kit In-Line 6TL35 455x600mm
AH500
Fixture Kit for Platforms featuring receiver Virginia Panel 9025 and external pusher system. Its heavy duty design supports more than 3000N.nnThe fixture kit includes the Base fixture (probe plate) as well as the Puhsers plate.
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Test Sockets
BGA/LGA
There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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PCI Express 4.0 Test Platform
The PCI Express 4.0 Test Platform provides a convenient means for testing PCIe 4.0 add-in cards with an internal interposer and power supplies. The Summit Z416 Test Platform provides the platform for the Summit Z416 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen4, Gen3, Gen2 or Gen1 hosts and devices. It supports SMBus and other sideband signals.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Regenerative Battery Pack Test System
17020
Chroma's 17020 is a high precision system specifically designed for secondary battery modules and pack tests. Accurate sources and measurements ensure the test quality that is suitable to perform repetitive and reliable tests that are crucial for battery modules / packs, for both incoming or outgoing inspections as well as capacity, performance, production and qualification testing. Chroma's 17020 system architecture offers regenerative discharge designed to recycle the electric energy sourced by the battery module ei ther back to the channel s in the sys tem performing a charging function or to the utility mains in the most energy efficient manner. This feature saves electricity, reduces the facilities thermal foot print and provides a green solution by reducing the environmental impact on our planet. Chroma's 17020 system is equipped with multiple independent channels to support dedicated charge / discharge tests, on multiple battery modules / packs, each with discrete test characteristics. The channels can easily be paralleled to support higher current requirements. This feature provides the ultimate flexibility between high channel count and high current testing.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Functional Test
cUTS
Get the essentials of measurement automation to power tests of simpler PCBAs and subassemblies. compactUTS (cUTS) is a cost-effective platform for automating manual tests of devices with fewer than fifty cable-accessible test points in manufacturing environments with moderate production volume. DUT-specific electrically keyed cables make changeover quick and easy.
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Three-Phase Smart Socket
WECO 3230
Utilize the RW-3X's features while on site in the van, as well as back at the shop with the WECO 3230 Three-Phase Smart Socket. The 3230 features built-in laser optics, Smart Socket™ technology and automatic meter form selection. Connect the RW-3X to the 3230 side panel using the included cables and the RW-3X Winboard Embedded software automatically sets the meter form, which will then populate on the WECO 3230 LCD display panel, and now you are ready to test. Not only does the 3230 make testing meters a snap, but it expands the current capability of the RW-3X to a full 50 amps, allowing the user to test class 320 amp meters.
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Socket Accessories (SMT Options)
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Test Sockets
MEMS Device
Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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DIP-to-JEDEC TO Adaptor Socket
1109522 & 1109523
DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Display Driver Test System
T6391
High-resolution flat-panel displays (LCDs / OLEDs) are becoming increasingly integrated. It is common for today's display driver ICs (DDIs) to contain a multitude of logic/analog circuits to manage advanced operations including touch-sensor functions. At the same time, the rapidly growing applications of LCDs / OLEDs in mobile electronics are driving demand for DDI's with smaller sizes and greater capabilities. These factors present serious IC-testing challenges. ADVANTEST's T6391 system is designed to address these needs along with DDIs' increasing number of pins and faster interfaces.
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Probe “Socket” Clamps
LCP-S12
A simple and cost-effective option for mounting Small-aperture Probes in the probe plate. A Socket Clamp tool is needed for insertion and removal of the clamp in the probe plate
