Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Product
Test Probes
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Petracarbon is a leading supplier and provider of spring contact probes and semiconductor test sockets.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
High Purity Germanium (HPGe) Radiation Detectors
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Semiconductor based photon radiation detectors have been evolving for over half a century, with ORTEC pioneering commercial availability for a majority of that time. Initial offerings were based around lithium-drifted germanium Ge(Li) and lithium-drifted silicon Si(Li). Ge(Li) was later replaced with more advanced, high purity germanium (HPGe) detectors. ORTEC provides a comprehensive suite of HPGe detector solutions covering an extensive range of energies and for a variety of applications.
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Product
High-Density Precision SMU (100 PA, 30 V)
PZ2130A
Source Measure Unit
The Keysight PZ2130A is a high-channel density precision source / measure unit (SMU) with 5 channels per module that saves space at a low cost per channel for a wide range of applications requiring numerous precision power supplies. Its seamless current measurement ranging function eliminates the time it takes to change the range and expands the dynamic range to cover multiple measurement ranges, which reduces test duration. These capabilities make the PZ2130A suitable for applications that require numerous precision power supplies, such as semiconductor reliability tests and integrated circuit (IC) tests. The Keysight PX0107A low noise filter adapter lowers its voltage source noise level, which makes the PZ2130A suitable for noise sensitive applications such as quantum computing as well.
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Product
Semiconductor Package Wind Tunnel
WT-100
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Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Product
SmartPower® Microwave Power Generators
AX2500
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SmartPower® AX2500 Series intelligent microwave power generators build on ASTeX's experience in producing rugged, reliable microwave power generators for demanding semiconductor fabrication and industrial applications. The AX2500 design architecture incorporates the best of ASTeX field-proven technology, and combines new design features aimed at improved performance and lower cost of ownership.
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Product
Semiconductor Test Platform
PAx
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PAx semiconductor test system delivers uncompromised RF performance in a low-cost system for testing RF power amplifiers and front-end modules for next-generation wireless standards.
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Product
Semiconductor Yield Management Software
QuickLoad-Central
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QuickLoad-Central is our new STDF filtering, analysis, reporting, managing, viewing and editing tool. It looks at all your STDF files before you need to, pulling out key information to pre-generate reports and help you quickly find the files you need. You can list files of interest with yield and header information on our dashboard, visualize your data, open pre-generated reports or push any information from them that you can think of to JMP, Excel or other analysis tools.
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Product
2MP HDR Jetson TX2/TX1 Camera Board
E-CAM20_CUTX2
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e-CAM20_CUTX2 is a 2MP HDR camera board for NVIDIA® Jetson TX2 /TX1 developer kit. It has an ability to stream seamlessly at wide temperature range (-40°C to 85°C). It enables an excellent low-light performance and can capture images even under 0.5 lux. e-CAM20_CUTX2 is based on 1/2.7" AR0230AT CMOS image sensor from ON Semiconductor™. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement.
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Product
IC Testing System
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Is a system for giving electrical signals to a semiconductor device to compare output signals against expected values for the purpose of testing if the device works as specified in its design specifications.
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Product
SoC Test System
T2000
Test System
SoC devices require small-lot high-mix manufacturing methods in the present era of rapid generation change. Semiconductor makers struggle with requirements to replace their testers on a 2-3 year cycle. The T2000 addresses their needs by enabling rapid response to market needs with minimum capital investment.
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Product
MASK MVM-SEM® E3600 Series
E3640
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Ongoing semiconductor process shrinks are driving new demand for stable, highly precise measurement of pattern dimensions for photomask and wafer production. The E3640 satisfies these requirements with industry-leading precision measurement capabilities and upgraded functionality that enhances mask R&D and production efficiency.
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Product
PED Systems
Pulsed Electron Deposition
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Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
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Product
Semiconductor Testing
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The integrated PXI platform and the open interfacing provides extension capabilities for additional testing requirements like DUT specific resistors-networks or temperature sensors. The Test System comes with the ready-to-run GTSoftware package and allows easy programming of test sequences (GTbuilder) and fast execution in production/test mode (GTengine).
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Product
13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD –
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e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Product
Moisture Analyzer
5800
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The 5800 is ideal for high-purity gas production, semiconductor gases, and the production, storage and transmission of olefins. It is suitable for use in industries including hydrocarbon processing, industrial gas and semiconductors.
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Product
TLP Tester
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Tokyo Electronics Trading Co., Ltd.
A method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures.
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Product
Micromanipulator
XYZ 300 Series
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Quarter Research and Development
The XYZ 300 Micropositioners provides 3-axis motion with .300" movement on each axis. Motion is controlled by three adjustment screw knobs that provide .025" resolution per turn. A general purpose micro positioner, it is intended for industrial, medical, biological, semiconductor, and general scientific applications.
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Product
Emulation Adapters
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With some of the more advanced 32-bit microcontrollers and SoCs, the full program and data trace capabilities of the device are not made available on production silicon. Instead, semiconductor vendors provide special 'emulation devices'. These typically feature more pins than the production device, thereby providing the interface to the trace interface.
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Product
Differential Picosecond Pulse Generators
PicoSource PG900 Series
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The fast-transition pulse can stimulate a transmission path, device or network with a broad spectrum signal in a single instant. Such a pulse is very useful for many of the high-speed broadband measurements that we need to make; for instance in time-domain reflectometry, semiconductor test, gigabit interconnect and port test and in radar.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
Power Cycling Semiconductor Life Test System
ITC52300
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The ITC52300 is designed for high-volume intermittent or steady-state operating life testing on Insulated Gate Bipolar Transistors (IGBTs), power MOSFETs, diodes, and other bipolar devices in a production environment. (The ITC52300 is an enhanced version of the ITC5230.)
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Product
Bonding Tester
PTR1102
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In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Product
LED Illumination
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Semiconductor device that emits visible light when an electrical current passes through it.
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Product
Electrostatic Capacitance-Type Non-Contact Thickness Meter
CL-5610 series
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The CL-5610/5610S is used to perform non-contact thickness measurement of objects under measurement including conductors, semiconductors and insulators in combination with the new-developed VE series capacitance type gap detector. The CL-5610/5610S can be connected up to 2 gap detectors and also used as 2-ch displacement meter.
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Product
Ultrasonic Transducers
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Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations.
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Product
Signal Generators
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2, 4 and 8 Channel Arbitrary Waveform Generator and Pulse Pattern Generator solutions are ideal choice in automated test benches, for physics experiments, semiconductor tests, analog and digital debugging.
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Product
Micro Volume pH Monitor
UP-100
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Redevelops HORIBA's founding pH measurement technology using new ultra-small capillary electrode. HORIBA's UP-100 affords ultra-low sample consumption of just 500 uL/measurement, enabling continuous pH monitoring for a variety of critical manufacturing processes that include Semiconductor (Cleaning, Etching and Plating); Chemical Manufacturing, Bio, Pharm, Food Processing, etc.Designed for 6 month continuous operation without operator intervention for minimizing downtime.
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Product
High Resolution Inline AXI Platform
AXI XS Series
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The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applications range from component level inspection to mid-sized SMT boards.
