Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Metrology
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Berliner Glas KGaA Herbert Kubatz GmbH & Co.
We make use of extensive measurement techniques and develop individual measurement setups in order to ensure that our optical components, assemblies and systems comply with your specifications. We create own software to measure customer-specific parameters.
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Metrology
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SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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Coupler Metrology
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Rosenberger Hochfrequenztechnik GmbH & Co. KG
Rosenberger provides directional coupler-based measurement techniques as well as probes for comprehensive cross-domain coupling analysis.Nowadays, the introduction of new accessories within vehicles, like rear seat infotainment, smart dashboards, and various advanced driver assistance systems, has increased the demand for high-speed automotive bus systems working in parallel with the high-voltage power networks in electric cars.
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Metrology System
IVS
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The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Metrology Search Engine
Qualer Search
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Qualer Search is the first metrology search engine that enables you to find potential partners based on services provided and their location.
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Dimensional Metrology Systems
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We are a global provider of optical industrial measurement technology for quality assurance of complex components with tight tolerances. With Bruker Alicona measurement systems, users measure dimension, position, shape, and roughness by using only one optical sensor. Measurement systems are applied in both research and directly on the shop floor.
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Automated Metrology
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KLA Instruments automated metrology instruments enable fab process control to quantify electrical properties, material deposited/removed, surface topography/roughness and critical dimensions. Automated metrology options include optical profilometry, stylus profilometry and film thickness mapping.
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E-beam Metrology And Inspection
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Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Surface Imaging & Metrology Software
Mountains®
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Analyze multiple types of surface data. Turn your surface data into accurate, visual surface analysis reports. See every feature with high quality real-time 3D imaging of surface topography. Characterize surfaces in accordance with the latest metrology standards.
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Universal 3D Metrology Software Platform
PolyWorks
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Defining the cutting edge of 3D metrology, the PolyWorks software suite maximizes productivity, quality, and profitability when integrating 3D measurement technologies into an industrial manufacturing process. From part and tool design and prototyping down to final inspection of assembled products, PolyWorks offers advanced solutions to cover the complete product development cycle. Interfacing directly with major brands and technologies of single-point and point cloud 3D measurement devices through plug-in extension modules, this universal platform also supports a wide array of native point cloud and polygonal model file formats.
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Metrology Device
XPLOR 100
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XPLOR 100 is a state of the art, fully automated metrology device designed for measurement and analysis of bubbles and inclusions for optical substrates in the Visible and NIR wave-bands.
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Manual Semiconductor Metrology System
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Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Metrology Training Services
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As a leading provider of precision measurement equipment we are experts at training new equipment customer on how to get the best out of the equipment and training in the accompanying software functionality. Training can take place at an API facility or your location. Customers will required to pass a competency test and will subsequently receive a certificate of training completion.
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Digital Readouts & Metrology Tools
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HEIDENHAIN digital readouts have universal applications. In addition to standard tasks on milling, drilling and boring machines and lathes, they also can be used with machine tools, measuring and testing equipment, and special machines in fact, they can be used with any machine where axis slides are traversed manually.
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2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
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Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Compact General-Purpose Metrology System
Benchmark 250
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The Benchmark 250 is a compact general-purpose metrology system with all the features and capabilities of the larger VIEW Micro-Metrology models. With travel of 300 x 150 x 150 mm, the Benchmark can accommodate a wide range of part sizes, and is rugged enough to be located in either a Q/A lab or an inspection station on the production floor.
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3D Metrology Solutions
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SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Metrology Systems
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High-precision, wavefront-based tools for measuring and testing optical components, specializing in Shack-Hartmann sensor technology.
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Scatterometers/ Thin Film Metrology Systems
LittleFoot Series
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The n&k LittleFoot-CD, and LittleFoot-CD450 are DUV-Vis-NIR scatterometers/thin film metrology systems, based on polarized reflectance measurements (Rs and Rp) from 190nm to 1000nm, with microspot technology. The systems in the LittleFoot-CD Series determine thickness, n and k spectra from 190nm-1000nm of thin films, as well as depths, CDs, and profiles of trenches and contact holes.
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Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Benchtop Metrology Solution
FilmTek 2000 PAR-SE
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Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Optical Metrology
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Complex measurements can be performed quickly and easily with optical measuring solutions from ZEISS. With a high degree of automation and state-of-the-art sensors, they reduce operating errors and guarantee high measuring accuracy.
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Automated Metrology System
EVG®50
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High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
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Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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Particle Metrology System
Archimedes
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Archimedes is an innovative instrument which uses the technique of resonant mass measurement to detect and accurately size and count particles in the size range 50nm to 5um*. Archimedes can distinguish different species from their buoyant mass is particularly useful when characterizing proteinaceous aggregates from contaminating silicon oil in biopharmaceutical preparations, in distinguishing bubbles from lipid micelles and contaminants in ultrasound contrast agents or protein from fat in dairy products.
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Dimensional Metrology System
PINNACLE PLUS
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Pinnacle+ Plus elevates Pinnacle performance to the next level. Pinnacle+ Plus features a rigid granite optical support structure and a high performance Z-axis motion assembly to produce the lowest possible uncertainty on micro-electronic parts and assemblies/
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Metrology System
Atlas V
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The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab.
