Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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GPU Edge Computers
AI workstations with GPU computing power are systems designed for industrial image analytic applications e.g. AOI, and medical image applications.
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Edge SRP
Edge SRP includes different packages of bundled hardware and software which can be used for data collection, edge computing, and data visualization.
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WebAccess Software & Edge SRP
Advantech’s WebAccess and other IoT software products provide a complete solution for device and data management to enable edge intelligence.
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MPI PA Wafer Probers
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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NVIDIA® Jetson Xavier™ NX Edge AI Vision Inference System
EOS-JNX Series
The EOS-JNX series has a built-in Smart PoE feature to control PoE power remotely to reduce maintenance efforts in challenging environments and provides PoE power loss detection to alert of any unexpected PoE disconnection. The EOS-JNX-I is designed as an AI PoE switch for connecting to IP cameras to enable AI inferencing, and also provides an uplink port to connect to a network video recorder (NVR) for recording video streams, making upgrading existing surveillance systems easy. The EOS-JNX-G is designed for industrial AI machine vision applications, providing a dedicated bandwidth of 1Gb per channel with a GigE camera connection, which is crucial for production line and manufacturing applications.
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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4U AI GPU Edge Server
AXE-7400SR
ADLINK's AI Edge Server AXE-7400SR series can be equipped with various acceleration cards according to application needs. The flexible and diverse combinations can meet the various changes in smart manufacturing applications, including GPU cards, motion control cards, IO cards, and image capture cards. AXE-7400SR features a single 4th Gen Intel® Xeon® Scalable Processor, 8x DDR5 DIMMs at 4800MT/s (8 channels, 1DPC), and supports up to 5x full-height PCIe slots for GPU/FPGA accelerator cards. Additionally, it includes a BMC with AST2600, IPMI v2.0/Redfish compliant, a dust-proof design, and a short chassis, making it suitable for factory and automation environments.
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Inline Wafer Electrical quality Inspection
ILS-W2
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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NVIDIA® Jetson Nano™ Edge Inference Platform
DLAP-211-Nano
- Deep learning acceleration with NVIDIA® Jetson Nano™- Compact fanless system 148(W)x120(D)x49.1(H)mm- Wide temperature range from -20°C to 70°C
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Intel® Movidius™ Myriad™-Based Industrial AI Smart Camera for the Edge
NEON-1000-MDX Series
ADLINK's NEON-1000 Series of industrial smart cameras supports the Intel® Movidius™ Myriad™ X VPU and a range of image sensors, providing users the flexibility to handle a wide variety of applications.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Automated Control System for Veneer Edge Gluing Line
Vikat
The automated veneer splicing line control system is designed to identify defective veneer areas, control the scrap trimming, bonding of suitable areas and the formation of output sheets of a given size.
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5G Edge Servers
ADLINK is committed to developing industry-leading edge computing platforms to drive the transformation of communications network architectures, and enable customers to explore new services and business models across various market segments. Validated for NGC-Ready and AWS IoT Greengrass, ADLINK’s OTII-compliant Edge Server MECS series provides a versatile, cost effective and scalable white-box solution to facilitate deployment of 5G RAN and private networks, and enable a wide range of 5G use cases, including 5G DU/CU in open RAN and private networks in smart factory, mining, transportation and more.
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1U 19” Edge Server With 4th Gen Intel® Xeon® Processor Scalable Family Processor
MECS-7120
- 1U 19” Edge Server with 4th Gen Intel® Xeon® Processor Scalable Family Processor- 6x DDR5 DIMMs, 4800MT/s (6 channels, 1DPC)- On-board 2x 25G SFP28 Ethernet ports- 1U 19’’ rackmount form factor for telecom infrastructure deployment- RunBMC with AST2600, IPMI v2.0/Redfish compliant- Optional clock module to provide time sync from GNSS- Designed for 5G: DU, DU+CU, DU+CU+MEC, MEC, uCPE, industrial edge computing
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Edge Compute Solutions
Innovate in real time. With the world’s largest serverless compute platform, Akamai puts your code closer to your users.
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Semi-Automatic Contactless Wafer Detector
NCS-200SA
Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Single Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Batch Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Kill A Watt Edge
P4490
Consumers have depended on the Kill A Watt® and the Kill A Watt® EZ for years to help them save energy and money. Now with the new Kill A Watt Edge it is easier than ever to gain insight on your consumption with the added experience of new features, for both the average and technically savvy consumer. The Kill A Watt Edge has all the measuring capabilities of its predecessors. There is an added CO2 function so that you may calculate your Carbon Footprint, and it has a dual display that shows multiple types of information at once. It will even calculate the consumption and cost of your devices when left in standby mode. Once you are familiar with those costs they are easily combatable with the programmable motion sensor, that will shut off your items when you are not in the room. After time the Edge will learn your behaviors and tell you how much you have saved when your devices are in real “off” mode.
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Contactless One-Point Wafer Thickness Gauge
MX 30x
The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Intelligent Edge Orchestration
Also known as edge orchestration, intelligent edge, or cloud orchestration, the evolving service cluster represents the newest generation of intelligent network-management system (NMS) technologies and capabilities. The edge-orchestration concept, however, runs much broader and deeper than NMS or element management system (EMS), providing far more intelligent, evolved, and numerous capabilities than originally conceived early-on during the technology's development.
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Compact Edge AI Platform For Various AI And AMR Applications
DLAP-411-Orin
ADLNK DLAP-411-Orin Edge AI Inference Platform powered by NVIDIA® Jetson AGX Orin™ is a high-performance platform designed for deployment of AI-powered systems at the edge, providing the computing power needed for demanding AI applications.
