Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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PCI Edge Connector Card
PMC239/F
The PMC239/F also comes with a fan. The fan can be disconnected from its power if not needed.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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360° Edge Analytics
360° Edge Analytics fills the gap between location data and the individual business application. The Location Data Analytics technology leverages precise position data augmented by application context information to gain business insights from complex processes. Assessment, optimization as well as process restructuring will be possible with nanotron’s complete solutions based on its Location-Aware IoT Platform with Location Data Analytics.
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Rugged IP67-rated Fanless Edge System With NVIDIA® Jetson™ TX2, HDMI, GbE LAN, 1-CH PoE, USB 2.0 And 100 To 240 VAC Power Input
eBOX800-900-FL
The Artificial Intelligence (AI) embedded system, eBOX800-900-FL, adopts a full IP67-rated extruded aluminum and heavy-duty steel case for dust protection and water resistance. Moreover, the AI embedded system comes with a wide operating temperature range of -30°C to 60°C (-22°F to +140°F) and a vibration endurance for up to 3Grms. The embedded system is powered by the NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor and 256-core NVIDIA® Pascal GPU. It features M12 type I/O connectors and four N-jack waterproof antenna openings for operational stability in rugged environments. The eBOX800-900-FL is ideal for AI edge computing and deep learning applications, such as smart city, smart manufacturing, smart transportation, and much more. The eBOX800-900-FL has 8GB of LPDDR4 memory and 32GB eMMC onboard. It comes with a wide range of 100 to 240 VAC power input with 10kV surge protection. The rugged edge computer also features one M.2 SSD PCIe 2.0 x4 socket which supports high-performance NVM Express interface for extensive storage needs. Furthermore, the embedded box PC is equipped with a PoE port to support the applications that require the use of IP cameras or any PoE device, i.e., traffic flow monitoring, license plate recognition, vehicle recognition, machine vision.
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Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Long Edge Wet Film Combs (Stainless Steel)
3238
Each comb has 24 measurement steps (teeth) providing a more accurate wet film thickness value.
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Edge AI Box
Arm-based edge AI boxes are powered by NXP, NVIDIA and Rockchip. They provide AI inference capabilities in a low-power fanless design.
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Operation Support System for Wafer Prober
N-PAF
N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Signage & Edge Computers
Compact, powerful computers and servers support diverse smart city applications at edge points.
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Fanless Edge System With NVIDIA® JETSON™ TX2, 1 HDMI 2.0,2 GbE LANs And 1 USB 2.0
eBOX560-900-FL
The eBOX560-900-FL employs a NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor; a 256 CUDA cores with NVIDIA® Pascal™ GPU Architecture; 8GB of LPDDR4 memory; and 802.11ac Wi-Fi with Bluetooth. It also supports NVIDIA JetPack 3.2 SDK including TensorRT, cuDNN, CUDA Toolkit, VisionWorks, GStreamer, and OpenCV, all built on top of L4T with LTS Linux kernel. The extremely compact system is your superb choices for AI, deep learning, and edge computing. Its tough construction is IP40-rated, and it has an extended operating temperature range of -30°C to +60°C (-22°F to +140°F) and up to 3G vibration endurance.
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Internet-Wide, Real-Time Data Sharing via the Cloud and the Network's Edge
Vortex Link
Vortex Link provides universally accessible Routing and Discovery Services that enable ubiquitous and transparent data sharing and WAN connectivity for Vortex DDS systems or any other system/device that uses a compliant Data Distribution Service (DDS) software stack. Vortex Link provides transparent discovery and routing between data readers and data writers regardless of location. Vortex Link supports a number of different deployment and connectivity scenarios, including individual device to cloud, system to cloud and also connecting your different LAN’s to turn them into a single system.
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
