Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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Semiconductor
Scientific Computing International
Materials which have a conductivity between conductors (generally metals) and nonconductors or insulators
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Semiconductor Electrical Test
We conduct electric property test (final test) of the completed (packaged) LSI products. We will support testing of analog devices, logic devices, other electronic parts, modules, application products and so on. We will test according to customer's specification regardless of evaluation, trial production, mass production, by know-how cultivated with long-time mass production results. Test initial examination ~ From consistent correspondence up to selection and evaluation, individual correspondence such as design only is accepted.
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Semiconductor Testers
Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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Semiconductor & Electronic Systems Test and Diagnostics Services
Reliability Test and Diagnostic services are offered to a wide range of customers that are active as Fabless Semiconductor or Integrated Device Manufacturers, automotive electronics supplier, Telecom and ICT application specialists, Industrial and Medical electronic system manufacturers or in Aerospace and Space applications. Independent high tech test and diagnostic service laboratory. IC and electronic module qualification. ESD and Latch Up testing. Design assessment by HALT/HASS. Failure and construction analysis.
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Semiconductor Test Platform
Diamondx DxV
The Diamondx DxV semiconductor test system provides full ATE performance in a desktop PC footprint. Fully integrated, ultra-compact test system designed to be used in the engineering lab or office. Unlike traditional semiconductor tester solutions that is no mainframe, separate workstation or support cabinets needed. The Diamondx DxV is completely stand-alone, so it can be placed on a bench or desktop:
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Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
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Impact Series Power Discrete Semiconductor Tester
The Impact Series Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.
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Semiconductor Test Equipment
IC Tester
Equipment to determine the pass/fail of devices in the wafer inspection process and the final inspection process after packaging.
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3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
SEMulator3D® is a powerful 3D semiconductor and MEMS process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex 3D structures created in the fab. Because the full integrated process sequence is modeled, SEMulator3D has the ability to predict downstream ramifications of process changes that would otherwise require build-and-test cycles in the fab.
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Semiconductor Optical Amplifiers
A Semiconductor Optical Amplifier (SOA) is essentially a laser diode (LD) with no feedback from its input and output ports and hence is also referred to as a Traveling-Wave Amplifier (TWA). Semiconductor Optical Amplifiers (SOAs) have proven to be versatile and multifunctional devices that are key building blocks for optical networks.
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Semiconductor
Semiconductor technology requirements often outpace the test coverage that traditional ATE provides for analog, mixed-signal, and RF test. Semiconductor test engineers need smarter solutions that address cost, scalability, design, and device challenges.
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300 Mm Semiconductor Processes
With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
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RF/MW Generators
Daihen Advanced Component, Inc.
Technical innovations such as miniaturization and three-dimensional applications are continuously happening in the field of semiconductors for making them more compact and packing more functionalities in them. “AVANCER” is a highly reliable (RF)power generator(s) brand equipped with various functions required by the next generation of semiconductor manufacturing processes, such as pulsed RF output and power saving. With proven technology and reliability, it contributes to the future of the ever evolving semiconductor industry.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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PXI 8x SPST High Voltage Reed Relays
40-310-001
The 40-310/320 range of high voltage switching modules will hot switch up to 750V peak and cold switch up to 1000V peak in either general purpose relay (40-310) or multiplexer (40-320) configurations. These modules contain high-quality reed relays with switching ratings comfortably higher than the 40-310/320 specification. Applications include; circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Compact Fan Type Ionizers
ER-Q Series
Panasonic Industrial Devices Sales Company of America
With Panasonic’s high-frequency AC method and “Sirocco Fan”, the ER-Q Compact Fan Type Ionizer can remove electrostatic charge even at slow fan speeds.ER-Q Ionizers are extremely compact and well suited for removing localized electrostatic charge on manufacturing equipment for electronics or in Semiconductor processes. The ER-Q Ionizers require no compressed air which eliminates air lines and reduces additional maintenance.
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PXI Switched Guard Reed Relay Module, 26x SPST
40-121-001
The 40-121-001 provides 26x SPST switches in a single slot PXI module and designed to provide an isolation resistance in excess of 1013Ω. It has been designed to ensure high isolation resistance through the use of switched guards, making it ideal for low level measurements and semiconductor test.
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Electronic Components
We supply a wide range of components and materials to the electronics industry, such as: integrated circuits for personal computers, semiconductor materials for system LSI, optical communication materials for telecommunications, components for display devices seen in smartphones and projectors, and materials used in solar cells and lithium batteries.
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PXI-5670, 2.7 GHz PXI Vector Signal Generator
778768-02
2.7 GHz PXI Vector Signal Generator—The PXI‑5670 has the power and flexibility you need for product development applications from design through manufacturing. It can generate custom and standard modulation formats such as AM, FM, PM, ASK, FSK, PSK, MSK, and QAM. The PXI‑5670 delivers a highly flexible and powerful solution for scientific research, consumer electronics, communications, aerospace/defense, and semiconductor test applications as well as for emerging areas including software defined radio, radio frequency identification (RFID), and wireless sensor networks.
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Non-Contact Chemical Concentration Monitor
CS-900
In order to fulfil the tight chemical concentration control required in semiconductor WET process, HORIBA realizes higher functionality to meet the needs by designing compact equipment while maintaining stable measurement and carrying out operator safety through its original sensor design.
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Semiconductor Memory Tester
T5851
Advantest Corporation has introduced the T5851 system, designed to provide a cost-effective test solution for high-performance universal flash storage (UFS) devices and PCIe BGA solid-state drives (SSDs) memory ICs in high demand by makers of low-power, mobile applications such as smart phones, tablets and ultra-portable laptops. The flexible T5851 tester is available in both production and engineering models. This allows the system to be used for reliability and qualification testing as well as test-program development or, when equipped with an automated component handler such as Advantest''''s M6242, high-volume production. As a fully integrated, system-level test solution, the T5851 provides multi-protocol support in one tool while its tester-per-DUT architecture and proprietary hardware accelerator allow it to achieve industry-leading test times.
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Semiconductor Test Platform
PAx
PAx semiconductor test system delivers uncompromised RF performance in a low-cost system for testing RF power amplifiers and front-end modules for next-generation wireless standards.
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Semiconductor Large Range Type Tester
HS-PSTT
HS-PSTT large Range Type Tester is a high-grade semiconductor material Type testing equipment,has the feature that testing large range,special suitable for testing the high-Resistivity Silicon Material(contains Silicon Core, phosphorus stick, Boron stick and so on),the resistivity require range is 0.0001～19999Ω·cm, Covers all measurement requirements of various silicon material type testing at the semiconductor and solar energy level at present .
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Sheet Resistance Measurement
The Filmetrics® R54-series and R50-series sheet resistance measurement instruments have been developed based on over 45 years of KLA sheet resistance measurement innovation. The R50 measures metal layer thickness, sheet resistance and sheet conductance. The R54-series adds a light-tight enclosure, along with 300mm support, to provide metal thickness measurement solutions for semiconductor and compound semiconductor manufacturing.
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5.0 MP Camera For Rockchip RK3399
E-CAM50_CU96
e-CAM50_CU96 is a 5MP Fixed focus MIPI camera for 96Boards compliant Rock960 developer kit featuring Rockchip RK3399 processor. This 4-lane MIPI Camera for Rock960 board is based on our popular low-light camera module, e-CAM55_CUMI0521_MOD which has 1/2.5" AR0521 CMOS Image sensor from ON Semiconductor® and a built-in Image Signal Processor (ISP). It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement.
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Dissolved Ozone Analyzer
Model 470
Teledyne Advanced Pollution Instrumentation
The Model 470 is a state-of-the-art Dissolved Ozone Sensor designed for semiconductor Wet Bench tools and many other industrial processes. It provides continuous measurement of dissolved ozone in deionized water or sulfuric baths with concentrations up to 150 mg/L. The Model 470 is “clean-ready” for high purity semiconductor processes, and is designed to be simply spliced in-line in the recirculation loop of any wet bench tool with flow rates up to 150 SLPM.
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Semiconductors
Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
