Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Coating Thickness Gauge for Ferrous and Non-Ferrous Materials
CM8856
* It meets the standards of both ISO2178 and ISO 2361 as well as DIN, ASTM and BS. It can be used both in the laboratory and in harsh field conditions.* The F probes measure the thickness of non-magnetic materials (e.g. paint,plastic, porcelain enamel, copper, zinc,aluminum , chrome etc.) on magnetic materials (e.g. iron, nickel etc.) . often used to measure the thickness ofgalvanizing layer, lacquer layer, porcelain enamel layer, phosphide layer, copper tile, aluminum tile, somealloy tile, paper etc.The N probes measure the thickness of non - magnetic coatings on non-magnetic metals .It is used on anodizing, varnish, paint, enamel,plastic coatings, powder, etc. appliedto aluminum, brass, non-magnetic stainless steel, etc.* Automatic substrate recognition.* Manual or automatic shut down.* Two measurement mode: Single andContinuous* Wide measuring range and highresolution.* Metric/Imperial conversion.* Digital backlit display gives exactreading with no guessing or errors.* Can communicate with PC computerfor statistics and printing by theoptional cable.* Can store 99 groups of measurements.* Statistics is available.2.SPECIFICATIONSDisplay: 4 digits LCD, backlitRange: 0~1250 μm/0~50mil(other ranges can be specified )Min.radius workpiece: F: Convex 1.5mm/Concave 25mmN: Convex 3mm/ Concave 50mmMin. measuring area: 6mmMin.Sample thickness : 0.3mmResolution: 0.1 μm (0~99.9μm);1 μm (over 100μm)Accuracy: ±1~3%n or 2.5 μm or 0.1mil(Whichever is the greater)Bttery Indicator: Low batter indicator.PC interface: with RS-232C interfacePower supply: 2x1.5 AAA(UM-4) batteryOperating condition: Temp. 0~50℃ .Humidity <95% .Size: 126x65x35 mm; 5.0x2.6x1.6 inchWeight: about 81g(not including batteries)Standard accessories:Carrying case ...................1 pc.Operation manual ............ 1 pc.F probe in built .................1 pc.NF probe in built...............1 pc.Calibration foils ..............1set.Substrate (Iron) ................1 pc.Substrate (Aluminium)......1 pc.Optional accessories: RS-232C cable & software:1.USB adaptor for RS-232C2.Bluetooth interface
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Wet Film & Powder Thickness
When applying a liquid coating, by measuring the uncured film thickness, it is possible to determine the eventual dry film thickness. Applying too much coating wastes time and materials. It can also affect the performance and finish of the product. Too much wet film can cause the coating to crack as it cures; too little coating increases the risk that the substrate will not be sufficiently protected, leading to rust spots.
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Leather Thickness Gauge
Crockmeter UI-TX50
Crockmeter (Crock Meter) is used to test color transfer of colored textile (leather, fabric and etc,) to other surface due to rubbing. It is test of colour fastness to rubbing, one of physical testing of textiles.
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Ultrasonic Thickness Gauge
TI-100K
TI-100K inherits high performance of predecessors including popular TI-45NA, and also have memory function and statistical processing performance.
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ITA, G10, 10 Module, 0.5" Standard thickness
410104123
ITA, G10, 10 Module, 0.5" Standard ThicknessUses VPC 90 Series Modules.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Ultrasonic Thickness Gauge
72DL PLUS
The Olympus 72DL PLUS™ ultrasonic thickness gauge delivers precision thickness measurements at high speed in a portable, easy-to-use device. With fast scanning, advanced algorithms, and our lowest-ever minimum thickness capability, you can confidently measure the thickness of very thin layers in the most challenging applications.
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Electrostatic Capacitance-Type Non-Contact Thickness Meter
CL-5610 series
The CL-5610/5610S is used to perform non-contact thickness measurement of objects under measurement including conductors, semiconductors and insulators in combination with the new-developed VE series capacitance type gap detector. The CL-5610/5610S can be connected up to 2 gap detectors and also used as 2-ch displacement meter.
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Thickness Gauge
Multigauge 5300 GRP
Designed to check the condition of Glass Reinforced Plastic (GRP) or Engineering Plastics. It can also be used on uncoated metal
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Layer Thickness Gauges
PeakTech Prüf- und Messtechnik GmbH
Coating thickness gauges are used for the non-destructive measurement of coatings such as paint or plastic on metallic surfaces.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8829
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 閸?-3%n or 閸?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45闁?/span>(32闁?/span>-104闁?/span>),闁?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Coating Thickness Gauge - Integral
Elcometer 456
Whether you are measuring on smooth, rough, thin or curved surfaces, the Elcometer 456 Dry Film Thickness Gauge produces accurate, temperature stable measurements thanks to its ±1% thickness measurement capability and increased reading resolution.
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Thickness Gauges for Plastic films & Paper
CHY-CA
CHY-CA is a highly precise thickness gauge with mechanical contact method, which can be used to measure the thickness of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
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Coating Thickness Meter for Ferrous and Non-Ferrous Materials
CM8826FN
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 鍗?-3%n or 鍗?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45閳?/span>(32閳?/span>-104閳?/span>),閳?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Operation Support System for Wafer Prober
N-PAF
N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Handheld Gauge for Nondestructive Coating Thickness Measurement
PHASCOPE PMP10
The most experienced device in our tactile portfolio – reliably solves all special applications.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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SENSOR FOR THICK & CURVED MATERIALS
S3
The smallest, simplest, most affordable high-precision non-contact sheet resistance sensor availableNon-contact measurement of Ohms/sq, Ohms-cm, resistivity, thickness, and moreChoose a sensor in one of four ranges, from .005 Ohms/sq to 100,000 Ohms/sqadd other sensors laterReads any conductive coatingon even the thickest nonconductive substratesOptions include PC-based productivity software, stage, and morePerformance limited by "lift off" phenomenonelevation of sensor above conductive layer must be carefully controlled
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Thickness Gauges
Bristol Instruments'' optical thickness gauges are a simple and non-destructive way to precisely measure thickness of a variety of transparent and semi-transparent materials. Thickness information is critical in the development and production of materials such as contact and intraocular lenses, and medical products including balloon catheters, stents, bags, and tubing. Bristol combines high accuracy with straightforward operation and rugged design to make these instruments ideal for both laboratory and manufacturing environments.
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Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Precision Coating Thickness Gauge Probe Range
Elcometer 355
Unique probe modules allow the Elcometer 355 Coating Thickness Gauge to be versatile and flexible for any coating thickness measurement application.
