Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Coating Thickness Measurement
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The Calotest instruments from Anton Paar provide quick, simple and inexpensive determination of coating thicknesses. Employing the simple ball-cratering method, the thickness of any kind of single or multi-layered coating stack is accurately checked in a short time, in full compliance with relevant international standards.
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Product
04 With Pins For PCB | 1 Wafer | 12 Positions
04-1xx4-20/70-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Paint & Powder Coating Thickness Gauge
415
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The new Elcometer 415 Industrial Paint & Powder Thickness Gauge provides simple, fast and accurate coating thickness measurements on smooth and thin industrial paint and powder coatings.
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Product
High Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
High Performance Fluorescent X-ray (XRF) Coating Thickness Gauge
FT150 Series
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Hitachi High-Technologies Corp.
The FT150 is a high-end fluorescent X-ray coating thickness gauge equipped with the polycapillary X-ray focusing optics and Vortex silicon drift detector. The improved X-ray detection efficiency enables high throughput and high precision measurement. Furthermore, new design to secure wide space around sample position gives exellent operability.
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Film Thickness Mapping Systems
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Angstrom Sun Technologies, Inc.
Spectroscopic reflectometer mapping (SRM) tools are for industry or lab routine thin film uniformity measurement. This is relatively low cost and easy to use setup. Mapping size can be configured from 2" to 18" if needed. Dependent on film thickness range, a broad wavelength range can be configured within DUV, Vis and/or NIR range. A user-friendly software interface allows you to define various mapping patterns to map. A CCD array based detecting and data acquisition mechanism offers fast measurements. 2D/3D data presentation gives user option to quickly generate reports.
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Product
Multi-mode Ultrasonic Thickness Gauge
MMX-6DL
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The MMX-6DL has all the features of the MMX-6 plus: An Internal data logger that stores a total of 1000 readings in 10 files of 100 readings each file. This gives the user the ability to store, and download the stored measurements directly to a PC using our DakView software program. The software and transfer cable are included in the MMX-6DL kit.
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Product
Coating Thickness Gauge Pen Type
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To meet diverse requirements of our clients in the best possible manner, we are offering a comprehensive assortment of Coating Thickness Gauge Pen Type, designed by our trained professionals using the top quality material and latest technology to render the utmost clients’ satisfaction. After knowing the requirements of thickness gauge in numerous industries, this thickness gauge is made available in a range of specifications.
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EMAT Thickness Gauges
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The EMAT thickness gauge uses advanced electromagnetic-acoustic technology to measure metal thickness, even in cases where traditional methods like piezo-ultrasonic or laser-optical are not applicable.
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Product
Flaw Detector & Thickness Gauge
DFX-8
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Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms
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Product
High Voltage Thick Film Planar Resistors
HVP
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*High resistance resistors for high voltage circuits.*Thin SIP shape*The flame retardant coats corresponding to UL94V-O are used*Thick film resistors ensure high stabilities in life and change in aging
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Product
Portable Thickness Gauge
Magna-Mike 8600
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The Magna-Mike® 8600 is a portable thickness gauge that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Thin-Film Thickness Measurement Systems
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The Filmetrics® range of affordable reflectometers deliver high-precision thin-film thickness measurements in seconds. These easy-to-use tools, combined with intelligent software and a broad range of accessories and configurations, provide maximum versatility in film thickness measurements ranging from 1nm to 3mm.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Thickness and Flaw Inspection
OmniScan MX2
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The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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Flaw Detector & Thickness Gauge
DFX-7+
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Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms.
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Glass Thickness Meters
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Now Detecting Laminated Glass! The Glass-Chek ELITE is suited perfectly for glass replacement, but it's perfect for many other applications as well. Whether you're installing ..
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Automated Wafer Prober for Magnetic Devices and Sensors
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Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Wet Film & Powder Thickness
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When applying a liquid coating, by measuring the uncured film thickness, it is possible to determine the eventual dry film thickness. Applying too much coating wastes time and materials. It can also affect the performance and finish of the product. Too much wet film can cause the coating to crack as it cures; too little coating increases the risk that the substrate will not be sufficiently protected, leading to rust spots.
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
Optics Test Equipment + Flatness, Bow, Warp, Curvature, Glass Thickness
Wedge Angle Scanner For Car Windshields
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Optik Elektronik Gerätetechnik GmbH
Scanning of complete car windshields for measurement of wedge angle and thickness distribution, in particular in the HUD area.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Contactless Wafer Geometry Gauge
MX 20x series
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The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Product
Wafer ESD Tester lineup
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Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Product
Thickness Measurement Testing
DRK3011B
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Shandong Drick Instruments Co., Ltd.
It is used for the durability test of children's mattress surface rolling and the test of the height of the cushion surface.
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Product
Thick Film Passive Element
GBR-250
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GBR-250 series high voltage resistors are made in a thick film technology on ceramic substrates (Al2O3 96%). These elements are used in high voltage applications.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
