Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Thick Film Passive Element
GBR-183
GBR-183 series resistors are made in a thick film technology, on ceramic substrates(Al2O3 -96%). Thick film resistors are characterized by a higher stability, and lower noises than a typical carbon resistors. The whole of resistor is encapsulated with epoxy resin by fluidization process. GBR-183 series elements are used both for general, and professional applications.
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Film Thickness Tester
MX Series
Qualitest covers a complete and competitive range of Thickness Testers for plastic films, composite films, adhesives, adhesive tapes, laminated films, plastic films, paper and other materials.
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Flaw Detector & Thickness Gauge
DFX-8
Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms
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EHC-03 Basic Corrosion Thickness Gages
EHC-03
Danatronics is pleased to welcome our EHC-03 to our corrosion thickness gage family. The EHC-03 is designed to accurately and non-destructively measure metal structures subject to corrosion.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Probe Needles for Wafer Sort and Test Applications
Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Coating Thickness Gauge
Beijing TIME High Technology Ltd.
A portable instrument used to measure the thickness of a dry coating on a substrate without damaging it.
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Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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TFProbe Wafer Measurement Tools
Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
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Automated Wafer Prober for Magnetic Devices and Sensors
Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Carpet Thickness Tester
TF620
TESTEX Testing Equipment Systems Ltd.
Digital Thickness Tester, to determine the thickness of carpets, underlays, nonwovens and geotextiles, this thickness tester is easily adapted to meet different test standards.
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Thickness and Flaw Inspection
OmniScan MX ECA/ECT
With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Substrate Thickness, Warp, and TTV Measurement
413 Series
Substrate Thickness, Warp, and TTV Measurement- with or without Tape- for Wafer Backgrind and Etch Thinning processes.Non-contact Echoprobe Technology.Thin film and surface roughness options.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Industrial Protective Coating Thickness Gauge
456 IPC
The Elcometer 456 Industrial Protective Coating Thickness Gauge1 is designed to measure dry film thickness on shot or grit blasted steel substrates.
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Portable Wafer Probe Station
PS-5026B
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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High Voltage Thick Film Planar Resistors
HVP
*High resistance resistors for high voltage circuits.*Thin SIP shape*The flame retardant coats corresponding to UL94V-O are used*Thick film resistors ensure high stabilities in life and change in aging
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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ATEX Certified Ultrasonic Thickness Gauge
Cygnus 1 Ex
The Cygnus 1 Intrinsically Safe is a rugged, shock-proof multiple echo ultrasonic surface thickness gauge designed for safely measuring metal thickness to determine wastage or corrosion in potentially explosive environments. By using multiple echo technology the metal thickness gauge measurements are error checked using 3 return echoes to provide repeatable, reliable results.
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Coating Thickness Meter for Automobiles - Ferrous and Non-Ferrous Substrates
CM8828FN
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm - Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Thick Film Divider
GBR-391
GBR-391 series high-voltage resistive dividers are made in a thick film technology on ceramic substrates (Al2O3 - 96%) with leads for through-hole mounting. Dividers are characterized by very high maximum voltage, and standard voltage division.
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Compact Coating Thickness Gauges
MP0 Series
The small all-rounders for mobile coating thickness measurement. Leading industrial instrument series for fast and easy coating thickness measurement in corrosion protection and industrial applications.
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Thickness and Flaw Inspection
OmniScan MX2
The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Thickness Gauge
MX-5
The MX-5 is a simple to use hand-held Ultrasonic Thickness Gauge. It offers features that make your job easier. An Alarm mode, Differential mode, high speed scanning, and data send are the main features of the MX-5. The MX-5 comes as a complete kit, ready to use, and is backed by Dakota Ultrasonics 5 year limited warranty.
