Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Paper Thickness Tester
DRK107B
Shandong Drick Instruments Co., Ltd.
DRK107B Paper Thickness Tester is applied to testing the thickness of paper specimens.
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Coating Thickness Gauge
Paint Thickness Gauge
Qualitest offers extensive range of advanced coating thickness gauges such as new Positector series and much more.
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WDXRF Wafer Analyzer
2830 ZT
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Dry Film Thickness
Dry film thickness, coating thickness or paint thickness as it is often known, is probably the most critical measurement in the coatings industry. It provides vital information as to the expected life of the substrate, the product’s fitness for purpose, its appearance and ensures compliance with a host of International Standards. In 1947, Elcometer launched one of the world’s first non-destructive coating thickness gauges, the Elcometer 101 Coating Thickness Gauge. For more than 6 decades, the design and production qualities of this rugged and reliable instrument have been the watchwords for all our products and these philosophies are still held today. Elcometer has a comprehensive range of Dry Film Thickness gauges to meet all of your coating inspection requirements.
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Ultrasonic Thickness Gauges
A widely used nondestructive test technique for measuring the thickness of a material from one side. It is fast, reliable, and versatile, and unlike a micrometer or caliper it requires access to only one side of the test piece.
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EHC-09 Ultrasonic Corrosion Thickness Gage - Color
EHC-09C
Danatronics offers our EHC-09 Color Wave series as the top of the line gages for corrosion applications. The EHC-09 Color Wave offers many standard and practical features including a sunlight readable color display with live A-Scan, echo to echo to ignore coatings, B-Scan, 100K thickness reading datalogger with interface to Microsoft excel. The Color Wave is available in 4 models including the EHC-09C, EHC-09DLC, EHC-09CW and EHC-09DLCW. The vibrate on alarm is a world’s first and is great for loud environments!
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Thick Film Passive Element
GBR-181
GBR-181series resistors are made in a thick film technology, or ceramic substrates (Al2O3) - 96&). Thick film resistors are characterized by a higher stability, and lower noises than a typical carbon resistors. The whole of resistor is encapsulated with epoxy resin by fluidization process. GBR-181 series elements are used both for general, and professional applications. Other values of resistance, and tolerance (up to 0.1%) are available on request.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Bare Wafer Inspection System
LS-6700
Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Thickness Gauge
Hildebrand Prüf- und Meßtechnik GmbH
You can select a Thickness Gauge based on a specific standard, a specifiy material or foot diameter and weight/pressure.
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Flaw Detector & Thickness Gauge
DFX-7
Automatic: probe zero, probe recognition, and Temperature compensation.Measurement: Variety of modes to address a number of applications.Large data storage with multiple formats: Alpha numeric grid and sequential w/auto identifier.Windows PC interface software.2 year limited warranty.
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Thin Film Composition and Thickness Monitor
P-1000
The Precision P-1000 readily analyzes compound thin films utilized in semiconductor, superconductor, magnetic and applications.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Thick Film Passive Element
GBR-395
GBR-395 series high voltage resistors are made in a thick film technology on ceramic substrates(Al2O3 96%). These elements are used in high voltage applications requiring high stability and resistance.
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Flatness, Bow, Warp, Curvature, Glass Thickness + Optics Test Equipment
Mobile Wedge Angle Sensor WAS 160
Optik Elektronik Gerätetechnik GmbH
Portable sensor for measurement of radius and wedge angle. Application: windshields of cars, helicopters, airplanes.
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Advanced Ultrasonic Thickness Gage
The 45MG is an advanced ultrasonic thickness gage packed with standard measurement features and software options. This unique instrument is compatible with the complete range of Olympus dual element and single element thickness gage transducers.
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Ultrasonic Wall Thickness Measurement Meters
The LaserLinc UltraGauge+™ series of ultrasonic meters and gauges measure wall thickness, layer thickness, and concentricity of plastic, rubber, glass, and metal products. Typical applications include tubing, hose, pipe, insulated wire, cable, and certain multi-layer products.
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Premium Handheld Coating Thickness Gauges
DUALSCOPE® FMP100 and H FMP150
Coating thickness measurement at the highest level. The device series for maximum flexibility and control in coating thickness measurement. Ideal for the use of inspection plans.
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Coating Thickness Gauge
CM8855
It meets the standards of both ISO2178 and ISO 2361 as well as DIN, ASTMand BS. It can be used both in the laboratory and in harsh field conditions. The F probes measure the thickness of non-magnetic materials (e.g. paint,plastic, porcelain enamel, copper, zinc, aluminum , chrome etc.) on magneticmaterials (e.g. iron, nickel etc.) . often used to measure the thickness ofgalvanizing layer, lacquer layer,porcelain enamel layer, phosphidelayer, copper tile, aluminum tile, some alloy tile, paper etc. The N probes measure the thickness of non - magnetic coatings on non-magnetic metals .It is used on anodizing, varnish, paint, enamel,plastic coatings, powder, etc. appliedto aluminum, brass, non-magnetic stainless steel, etc. Automatic substrate recognition. Manual or automatic shut down. Two measurement mode: Single and Continuous Wide measuring range and high resolution. Metric/Imperial conversion. Digital backlit display gives exact reading with no guessing or errors. Can communicate with PC computer for statistics and printing by the optional cable. Can store 99 groups of measurements. Statistics is available.2.SPECIFICATIONSDisplay: 4 digits LCD, backlitRange: 0~1250 μm/0~50mil (other ranges can be specified )Min.radius workpiece: F: Convex 1.5mm/Concave 25mmN: Convex 3mm/ Concave 50mmMin. measuring area: 6mmMin.Sample thickness : 0.3mmResolution: 0.1 μm (0~99.9μm);1 μm (over 100μm)Accuracy: ±1~3%n or 2.5 μm or 0.1mil(Whichever is the greater)Bttery Indicator: Low batter indicator.PC interface: with RS-232C interfacePower supply: 2x1.5 AAA(UM-4) batteryOperating condition: Temp. 0~50℃ .Humidity <95% .Size: 126x65x35 mm; 5.0x2.6x1.6 inchWeight: about 81g(not including batteries)Standard accessories:Carrying case ...................1 pc.Operation manual ............ 1 pc.F probe in built .................1 pc.NF probe in built...............1 pc.Calibration foils ..............1set.Substrate (Iron) ................1 pc.Substrate (Aluminium)......1 pc.Optional accessories: RS-232C cable & software:1.USB adaptor for RS-232C2.Bluetooth interface
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Coating Thickness Gauge
Guangzhou Amittari Instruments Co.Ltd
The Basic Type Coating Thickness Gauge AC-110 Series have two types: Type C ( Integral Type ), Type CS ( Separate Type ); Suitable for automotive, paint layer coating thickness measurement; Integral Type suitable for single-hand operation, large probe with large contact surface have better stability, users can get continuous, good repetitive and precise measurements. Separate Type can provide several type probe, measure can be more flexibility. It is a kind of portable measuring instrument, it can quickly, no damage and precise coating, coating thickness measurement. Not only can be usedin the laboratory, also can be used in the engineering field. Through the use of different measuring head, but also can meet the needs of a variety of measurement. Widely used in manufacturing, metal processing industry, chemical industry, commodityinspection and testing field. Is the material protection professional.
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ECHO 8 Ultrasonic Corrosion and Precision Thickness Gage
ECHO 8
Danatronics offers our newest ultrasonic precision thickness gage line, the ECHO 8 series. ECHO 8 represents our most advanced thickness gage ever combining dual and single element transducers all in one small package. ECHO 8 offers a 3.5” high resolution sunlight readable color display with live A-Scan, use of a wide variety of dual, contact, delay line and immersion transducers from 1-20 Mhz as default and custom created and stored applications setups, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 8 is available in 4 models including the ECHO 8, ECHO 8DL, ECHO 8W and ECHO 8DLW. The vibrate on alarm feature is the world’s first and is great for loud environments
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A-/B-Scan Thickness Gauge For NDT
SONOWALL® 70
SONOWALL 70 is the first thickness gauge in the market with intelligent probe identification. The extended probe management allows probe-specific information such as DAC-curves, delay lines, and serial numbers to be saved directly in the ultrasonic probe. In addition to various thickness applications, the device can be upgraded to a full-function flaw detector.
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LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Wafer Probe Test System
STI3000
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Benchtop Unit for Universal Coating Thickness Measurement
FISCHERSCOPE MMS PC2
Multifaceted for coating thickness measurement and material testing. Universal multi-measuring system for parallel coating thickness measurement and material testing with up to eight measuring modules.
