Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Ultrasonic Thickness Gauges
MMX 6 + MMX 6DL
The new wall thickness gauges MMX-6 and MMX-6DL includes all the features of the MX devices with the additional unique possibility to measure on coated parts without the coating is applied in the measurement (Echo Echo + pulse-echo function)
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Distance, Coating and Thickness Meters
PeakTech Prüf- und Messtechnik GmbH
This professional laser distance measuring device with multi-line LCD display, which has a backlight, was specially designed for high-precision distance measurements.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Hall Effect Thickness Gage
Magna-Mike 8600
The Magna-Mike® 8600 is a portable thickness gage that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Multi-mode Ultrasonic Thickness Gauge
MMX-6DL
The MMX-6DL has all the features of the MMX-6 plus: An Internal data logger that stores a total of 1000 readings in 10 files of 100 readings each file. This gives the user the ability to store, and download the stored measurements directly to a PC using our DakView software program. The software and transfer cable are included in the MMX-6DL kit.
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Thickness Tester
Shenzhen UYIGAO Electronic Technology Co., Ltd
The coating thickness gauge is designed for non-destructive, fast and precise coating thickness measurement.
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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ITA, G10, 10 Module, 0.88" Thickness
410104375
ITA, G10, 10 Module, 0.88" ThicknessCompatible with VPC 90-Series modules.
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Thick Film Bleeder
GBR-350
GBR-350 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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High Precision Thick Film Chip Resistors
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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EMAT Thickness Gauges
The EMAT thickness gauge uses advanced electromagnetic-acoustic technology to measure metal thickness, even in cases where traditional methods like piezo-ultrasonic or laser-optical are not applicable.
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Precision Thick Film Chip Resistors
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Solar Wafer Transfer Tool
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Thickness Measurement
Thickness Tester is a high precision mechanical contact method thickness tester, which can be used to thickness measurement of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Ultrasonic Thickness Gauge
SONOWALL® 50
The SONOWALL 50 features a highly accurate data read out and a large measurement range. An integrated data logger and its user-friendly operation make the device ready for a wide variety of applications. The included software is a convenient tool to store and evaluate the measurements.
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Ultrasonic thickness gauge
The frequency range of sound that can be heard by the human ear is about 20Hz to 20KHz, and sound waves with higher frequencies are called ultrasonic waves. In general ultrasonic flaw detection equipment, 5MHz is often used in the range of 1MHz to 20MHz as standard.
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Moisture / Thickness / Density Meters
On-line multi IR wavelength analyzer utilizing infrared absorption technology for measuring product constituent and/or thickness.
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Coating Thickness Meters
PCE Instruments' accurate, affordable coating thickness gauge, thickness meter, surface testing and film gauge devices are used for material testing, manufacturing quality control and automotive paint inspection applications. Choose from a variety of coating thickness gauge, mil gage or paint meter products used for the non-destructive measurement of nonmagnetic coating, insulating layer and dry film thickness (DFT) on ferrous and / or non-ferrous metal substrates such as steel and aluminum.
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Ultrasonic Thickness Gauges
Used for measuring thickness and corrosion of pressure vessels,chemical equipment,boilers,oil storage tanks,etc.in industries of petroleum,shipbuilding,power station,and machine manufacturing.
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Ultrasonic Thickness Gauge
Is a widely used nondestructive test technique for measuring the thickness of a material from one side.
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ROV Thickness Gauges & Probe Handlers
ROV Thickness Gauges & Probe HandlersCompleting the Cygnus ROV Mountable thickness gauges, a range of ROV Probe Handlers have been developed to offer an engineered probe handling solution. Each probe handler will work with a thickness gauge of the Cygnus ROV Mountable range listed below.
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Thickness Gauging
There are two main types of thickness gauges; the Box Gauge for measuring on aluminium and clad aluminium strip, and the C-frame Gauge for measuring on any non-ferrous strip and foil.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Compact Coating Thickness Gauges
MP0R-FP Series
Compact pocket coating thickness gauges with connected cable probe and PC-interface for a convenient, fast and nondestructive coating thickness measurement on virtually all metals
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Hand Held Ultrasonic Thickness Meter
Multigauge 5600
On screen user information such as probe frequency and remaining battery. Colour LCD display. Easy to use keypad and menu system.
