Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Wafer Test
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Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Product
Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Product
Edge Gateway
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Arm-based industrial gateways are based on NXP, Qualcomm, Rockchip, and TI, delivering LTE, 5G and Wi-Fi with wide operating temperature range.
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Product
Long Edge Wet Film Combs (Stainless Steel)
3238
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Each comb has 24 measurement steps (teeth) providing a more accurate wet film thickness value.
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Fanless Network Appliance For SD-WAN& UCPE Edge Deployment With Coming 5G & Wi-Fi 6 Support. Ideal For SD-WAN Deployments.
FWA-1112VCL
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Intel® Atom® C3000, up to 8 CoresIP40, fanless design, 0 ~ 40°C temperature rangeUp to 4 x 1GbE RJ-45 + 2 x 10GbE SFP slots or 1 x 1GbE SFP and 6 x RJ-45 slots5G LTE and Wi-Fi 6 RF certifiedIntel® QAT integrated2 x PoE+ support (optional)
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Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Edge Radius Measurement
EDGEINSPECT
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NOVACAMTM EDGEINSPECTTM system is a modular, non-contact 3D metrology system that:Measures, down to the micron, any type of edge: cutting edges, inside or outside edges, edges on round holes, straight edges, etc.
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Product
MicroATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Edge Computing, Industrial Automation, And Compact Servers.
ASMB-589
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Powered by LGA 1851 Intel® Core™ Ultra 9/7/5 processors with W880 chipset for high-performance computing.Supports up to 192 GB of DDR5 ECC/Non-ECC UDIMM memory at speeds of 5600/4800/4400 MT/s for demanding applications.Features two PCIe x16 (Gen5) and two PCIe x8 (Gen4) slots for flexible expansion with high-speed peripherals.Offers versatile display connectivity with DisplayPort, VGA, and HDMI 2.0 ports, supporting triple simultaneous displays.Provides extensive storage options with five SATA 3 ports and eight high-speed USB 3.2 ports for peripheral connectivity.Includes one M.2 2280 slot (PCIe x4) for fast NVMe SSD storage, enhancing system boot and application load times.Designed with rackmount-optimized placement and positive airflow for enhanced thermal performance in server environments.Ensures reliable operation in industrial environments with an ambient operating temperature range of 0 ~ 60°C (32 ~ 140°F).
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
LTE Advanced Edge Computing Gateways - ICR-4400
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The LTE advanced (Cat.12) high-speed 4G routers & powerful edge computing gateways with a variety of interfaces focused on complex router and IoT task.
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Product
GPU Edge Computers
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AI workstations with GPU computing power are systems designed for industrial image analytic applications e.g. AOI, and medical image applications.
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Product
NVIDIA® Jetson™ Xavier NX-based Industrial AI Smart Camera for the Edge
NEON-2000-JNX Series
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ADLINK NEON-2000 series is the NVIDIA® Jetson™ based industrial AI cameras, which integrates the Jetson Xavier NX or Jetson™ TX2, Image Sensor, Optimized OS, Rich I/O for vision applications in a compact chassis and verified thermal performance, that saves not only users' TCO (Total Cost Ownership) on the integration and trouble shooting, but also the dimension and cables on the installation.
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Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
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The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Product
4-Slot Edge Intelligent DAQ Controller
ADAM-5630
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Support Modbus/RTU, Modbus/TCP Client and Server function librariesC and Python programming based on Linux operating systemSupport Web server for I/O configuration and monitoringBuilt-in real-time clock and watchdog timer4 serial communication ports onboard2 Ethernet Ports4 or 8 I/O slot expansion1 micro SD slot expansion for data storage
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Product
High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
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The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Product
AIR Edge AI HPC
AIR-540
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Edge AI HPC Powered by AMD EPYC 8004 series, support 4pcs 2.5-slot GPUs. Powered by the energy-efficient AMD EPYC™ 8004 Series Processor. 4pcs 2.5-slot GPUs for high-density computing. 6x DDR5 ECC-REG RDIMMs for superior reliability and performance.
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Product
04 With Pins For PCB | 3 Wafers | 12 Positions
04-3xx4-20/70-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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AIR Edge AI Inference Systems & Servers
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Advantech’s AIR series provide solutions for Edge AI Inference, offering optimal CPU, AI computing, thermal management, and I/O integration
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Internet-Wide, Real-Time Data Sharing via the Cloud and the Network's Edge
Vortex Link
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Vortex Link provides universally accessible Routing and Discovery Services that enable ubiquitous and transparent data sharing and WAN connectivity for Vortex DDS systems or any other system/device that uses a compliant Data Distribution Service (DDS) software stack. Vortex Link provides transparent discovery and routing between data readers and data writers regardless of location. Vortex Link supports a number of different deployment and connectivity scenarios, including individual device to cloud, system to cloud and also connecting your different LAN’s to turn them into a single system.
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Product
1U 18" Short-Depth Edge Server
HPC-6120+ASMB-610
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1U 18" short-depth edge server with Intel® Xeon® W CPU, 128GB DDR4, and 4 PCIe slots. Designed for reliable edge AI, automation, and data acquisition.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
MEC Server
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
Fanless Network Appliance For Edge Deployment With 5G And Wi-Fi6. Ideal For Edge Computing And 5G Network Infrastructure.
FWA-1212VC
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Intel Atom® C3336/C3558 network SoC with Intel® QuickAssist Technology1 x DDR4 2133/2400MHz, SODIMM (ECC optional) up to 16GB2 x 1GbE SFP/RJ-45 combo ports (auto-negotiation) + 4 x 1GbE RJ-45 LAN portsReserve 1 x M.2 3052/3042 / 1 x M.2 2230 and 1 x Mini-PCIe for RF module selectionDefault 16GB eMMC onboard
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
04 With Pins For PCB | 4 Wafers | 24 Positions
04-4xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Compact Size Mid Tower GPU Server AMD® EPYC™ 8004 Series Processor For Edge AI Inference, Industrial Automation, And Compact GPU Workloads.
SKY-602E3
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Processor: Single AMD® EPYC™8004 Series Server ProcessorMemory: 6 x DDR5-4800 MHz ECC RDIMM, up to 576GBRemote Management: IPMI function supportExpansion: Supports 4 x PCIe x16 double-deck FH/10.5" cards or 2 x PCIe x16 double deck FH/10.5" cards + 4 x PCIe x8 single deck FH/10.5" cardsPSU: 800 Watt 1+1 redundant power supply with 80+ platinum level certification
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Product
01 With Pins For PCB | 12 Positions | M6 | 2 Wafers
01-2xxx-20/70xx-12-M
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The M6 variant represents the most compact mounting option in the Type 01 12-position family. Despite its smaller 6mm bushing, this 2-wafer selector switch offers high-performance multi-deck switching. It is specifically designed for miniaturized electronic devices and handheld industrial controllers that require a 30° detent and long-life durability.
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4U 4GPU High Performance Edge Server With Dual AMD EPYC 9004/9005 Processors
SKY-641E3
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Support all AMD EPYC 9004/9005 family CPU up to 400W TDP24x DDR5 5600Mhz RDIMMSupport PCIe Switch Backplane, Up to 10 FHFL x16, 4 FHHL x8 PCIe Gen48 2.5" NVMe and 2 M.2 2280 NVMe SSD support1 OCP 3.0 PCIe Gen5 x16 NIC support
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High-Performance AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-iX000-P Series
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The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
